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Mechanical Behavior of Nanocrystalline Cu Alloy Thin Film on Elastomer Substrates Under Constant Uniaxial Tensile Strain

Published online by Cambridge University Press:  26 February 2011

Junya Inoue ,
Yousuke Fujii  and
Toshihiko Koseki
Junya Inoue
Affiliation:
[email protected], The University of Tokyo, Department of Materials Engineering, 7-3-1 Hongo, Bunkyo, Tokyo, 113-8656, Japan, +81-3-5841-7165, +81-3-5841-2773
Yousuke Fujii
Affiliation:
[email protected], The University of Tokyo, Department of Materials Engineering, 7-3-1 Hongo, Bunkyo, Tokyo, 113-8656, Japan
Toshihiko Koseki
Affiliation:
[email protected], The University of Tokyo, Department of Materials Engineering, 7-3-1 Hongo, Bunkyo, Tokyo, 113-8656, Japan
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Abstract

In this study, mechanical behavior of nanocrystalline Cu alloy thin films under constant tensile strain is studied, by taking advantage of the enhanced resistance to strain localization of a thin metal film on a thick elastomer with appropriate Young's modulus. Cu and Cu alloy thin films with a thickness of 100nm were deposited on heat-resistant polyimide substrates. On the top of the Cu alloy layer, Ta thin film was further deposited to suppress the surface diffusion of Cu alloy. A uniform uniaxial tensile strain was induced to the films by applying a constant radius of curvature to the polyimide substrate. Isothermal deformation and rupture modes of the films were studied by keeping the samples at various elevated temperatures. Microstructural observation was carried out using SEM, TEM, STEM, and confocal violet laser microscope at several stages of deformation. From the observation, the evolution of damage in the sub-critical strain level and the effect of alloying elements are discussed.

Keywords

thin filmCuductility
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 976: Symposium EE – Size Effects in the Deformation of Materials – Experiments and Modeling , 2006 , 0976-EE10-09
Copyright
Copyright © Materials Research Society 2007

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