Hostname: page-component-78c5997874-xbtfd Total loading time: 0 Render date: 2024-11-19T02:55:44.015Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical and Thermophysical Properties of Thin Film Materials for Mems: Techniques and Devices

Published online by Cambridge University Press:  15 February 2011

E. Obermeier
E. Obermeier*
Affiliation:
Technical University of Berlin, Department of Electrical Engineering, Microsensor and Actuator Technology Center, TIB 3.1, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany, [email protected]
Get access

Abstract

An abstract is not available for this content so a preview has been provided. Please use the Get access link above for information on how to access this content.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 444: Symposium I – Materials for Mechanical and Optical Microsystems , 1996 , 39
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. King, J.A., Materials Handbook for Hybrid Microelectronics, Artech House, Inc. (1988).Google Scholar
2. Landoldt-Börnstein, , Numerical Data and Functional Relationships in Science and Technology, Springer Verlag, (1982).Google Scholar
3. Wortman, J. J., Evans, R. A., J. Appl. Phys. 36, p. 153 (1965).Google Scholar
4. Senturia, S.D., IEEE Micro Robots and Teleoperation Workshop, Hyannis, MA, USA, p. 11 (1987).Google Scholar
5. Obermeier, E., Proc. Int. Symp. Microsystems, Intelligent Materials and Robots, Sendai, Japan, p. 110 (1995).Google Scholar
6. Nicholson, E.D. and Shield, J.E., J. Hard. Mater. 5, p. 89 (1994).Google Scholar
7. Vinci, R.P. and Bravman, J.C., Digest Techn. Papers, Int. Conf. on Solid-State Sensors and Actuators, Transducers '91, San Francisco, CA, USA, p. 943 (1991).Google Scholar
8. Schweitz, J.-Å., MRS Bulletin 17(7), p. 34 (1992).Google Scholar
9. Weihs, T.P., Hong, S., Bravman, J.C., and Nix, W.D., J. Mater. Res. 3(5), p. 931 (1988).Google Scholar
10. Tabata, O. et. al., Sensors & Actuators 20, p. 135 (1989).Google Scholar
11. Stewart, R. A., Kim, J., Kim, E.S., White, R.M., and Muller, R.S., Sensors and Materials 2(5), p. 285 (1991).Google Scholar
12. Maier-Schneider, D. et al., J. Micromech. & Microeng. 2, 173 (1992).Google Scholar
13. Maier-Schneider, D., Maibach, J., Obermeier, E., and Schneider, D., J. Micromech. & Microeng. 5, 121 (1995).Google Scholar
14. Petersen, K. E. and Guarnieri, C. R., J. Appl. Phys. 50(11), p. 6761 (1979).Google Scholar
15. Kiesewetter, L. et al., Sensors & Actuators A 35, p. 153 (1992).Google Scholar
16. Zhang, L. M. et al., Sensors & Actuators A 29, p. 79 (1991).Google Scholar
17. Tang, W. C. et al, Proc. IEEE MEMS Workshop, Salt Lake City, Ut, USA, p. 53 (1989).Google Scholar
18. Hirano, T. et al., Digest of Techn. Papers, Int. Conf. on Solid-State Sensors and Actuators, Transducers' 91, San Francisco, CA, USA, p. 873 (1991).Google Scholar
19. Pratt, R. I. et al., Digest of Techn. Papers, Int. Conf. on Solid-State Sensors and Actuators, Transducers' 91, San Francisco, CA, USA, p. 205 (1991).Google Scholar
20. Biebl, M. et al., Digest of Techn. Papers, Int. Conf. on Solid-State Sensors and Actuators, Transducers' 95, Stockholm, Sweden, p. 80 (1995).Google Scholar
21. Putty, M. W. et al., Proc. IEEE MEMS Workshop, Salt Lake City, Ut, USA, p. 60 (1989).Google Scholar
22. Tai, Y.-C. and Muller, R. S., Proc. IEEE MEMS Workshop, Napa Valley, CA, USA, p. 147 (1990).Google Scholar
23. Guckel, H. et al., Techn. Digest IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, USA, p. 96 (1988).Google Scholar
24. Ding, X. et al., Sensors & Actuators A21 - A 23, p. 866 (1990).Google Scholar
25. Johansson, S. et al., J. Appl. Phys. 63, p. 4799 (1988).Google Scholar
26. Ericson, F. and Schweitz, J.-Å., J. Appl. Phys. 68, p. 5840 (1990).Google Scholar
27. Tsuchyia, T., Tabata, O., Sukata, J., and Taga, Y., Techn. Digest 14th Sensor Symp., Kawasaki, Japan, p. 171 (1996).Google Scholar
28. Sato, K. et al., Techn. Digest 14th Sensor Symp., Kawasaki, Japan, p. 167 (1996).Google Scholar
29. Greek, S., Ericson, F., Johansson, S., and Schweitz, J.-Å., Digest Techn. Papers, 8. Int. Conf. on Solid-State Sensors and Actuators, Transducers '95, Stockholm, Sweden, p. 56 (1995).Google Scholar
30. Doerner, M.F., CRC Critical Rev. Solid-State and Mat. Science 14(3), p. 225 (1988).Google Scholar
31. Stoney, G. G., Proc. Royal Soc. London, Series A, A 82, p. 172 (1909).Google Scholar
32. Ferrari, M. and Weber, M., Mat. Res. Soc. Symp. Proc. 276, p. 221 (1992).Google Scholar
33. Guckel, H., Randazzo, T., and Bums, D.W., J. Appl. Phys. 57(5), p. 1671 (1985).Google Scholar
34. Mehregany, M., Howe, R.T., and Senturia, S.D., J. Appl. Phys. 62(9), p. 3579 (1987).Google Scholar
35. Lober, Th. A. et al., Techn. Digest IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, USA, p. 92 (1988).Google Scholar
36. Orpana, M. and Korhonen, A. O., Digest of Techn. Papers, Int. Conf. on Solid-State Sensors and Actuators, Transducers' 91, San Francisco, CA, USA, p. 957 (1991).Google Scholar
37. Goosen, J. F. L. et al., Digest Techn. Papers, 7th Int. Conf. on Solid-State Sensors and Actuators, Transducers' 93, Yokohama, Japan, p. 783 (1995).Google Scholar
38. Yang, E. H. and Yang, S. S., Digest Techn. Papers, 8th Int. Conf. on Solid-State Sensors and Actuators, Transducers' 95, Stockholm, Sweden, p. 68 (1995).Google Scholar
39. Maseek, F. et al., Techn. Digest IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, USA, p. 84 (1988).Google Scholar
40. Tiwary, H.V. and Sao, G.D., J. Phys. E: Sci. Instrum. 14, p. 1378 (1981).Google Scholar
41. Graebner, J. E. and Jin, S., SPIE Vol.1759 Diamond Optics V, p. 167 (1992).Google Scholar
42. Goodson, K. E. et al., IEEE Electr. Dev. Letters 14(10), p. 490 (1993).Google Scholar
43. Fournier, D., Plamann, K., Diamond and Related Materials 4, p. 809 (1995).Google Scholar
44. Gustafsson, S. E. et al., J. Phys. D: App. Phys. 12, p. 1411 (1979).Google Scholar
45. Cahill, D. G. et al., Philosophical Magazine B 71, p. 677 (1995).Google Scholar
46. Tai, Y. C. et al., J. Appl. Phys. 63, p. 1442 (1988).Google Scholar
47. Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., J. Heat Transfer 116, p. 317 (1994).Google Scholar
48. Goodson, K.E., Käding, O.W., Rösler, M., and Zachai, R., J. Appl. Phys. 77(4), p. 1385 (1995).Google Scholar
49. Jansen, E. and Obermeier, E., J. Micromech. & Microeng. 6, p. 118 (1996).Google Scholar
50. Graebner, J.E., Mucha, J.A., Seibles, L., and Kammlot, G.W., J. Appl. Phys. 71(7), p. 3143 (1992).Google Scholar
51. Zhang, X. and Grigoropoulos, C.P., Rev. Sci. Instr. 66(2), p. 1115 (1995).Google Scholar
52. Sabuga, W. and Hammerschmidt, U., Int. J. Thermophysics 16(2), p. 557 (1995).Google Scholar
53. Cahill, D.G., Rev. Sci. Instr. 61(2), p. 802 (1990).Google Scholar