Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-29T08:03:17.517Z Has data issue: false hasContentIssue false
  • English
  • Français

Measurement of Mechanical Properties in Small Dimensions by Microbeam Deflection

Published online by Cambridge University Press:  10 February 2011

O. Kraft ,
R. Schwaiger  and
W.D. Nix
O. Kraft
Affiliation:
Max-Planck-Institut für Metaliforschung, Seestr. 92, D-70174 Stuttgart, Germany
R. Schwaiger
Affiliation:
Max-Planck-Institut für Metaliforschung, Seestr. 92, D-70174 Stuttgart, Germany
W.D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305-2205
Get access

Abstract

In this paper, we describe a technique for measuring elastic and plastic properties of thin films by microbeam deflection. The test procedure is similar to a macroscopic bending test where an external load is applied to a beam and its bending measured. Silicon oxide microbeams were made by different growth, lithography and etching techniques. The beams were then deflected with a nanoindenter, while the applied load and the displacement of the beam were recorded. Young's modulus was determined from the initial linear load-displacement behavior. Some beams were notched using a focused ion beam technique and loaded until brittle fracture occurred. These measurements permit the determination of the fracture toughness of the beam materials. In order to study plastic deformation in thin Ag films, the method was extended by depositing films onto the beams and measuring the behavior of the beam/film composite. Yielding of the Ag film was seen as a deviation from the linear-elastic behavior of the beam.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 518: Symposium N – Microelectromechanical Structures for Materials Research , 1998 , 39
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Ruud, J.A., Josell, D., Spaepen, F. und Greer, A.L., J. Mater. Res. 8, 112–117 (1993)Google Scholar
[2] Schadler, L.S. und Noyan, I.C., Appl. Phys. Lett. 66, 22 (1995)Google Scholar
[3] Kretschmann, A., Kuschke, W.-M., Baker, S.P. und Arzt, E. in Thin Films: Stresses and Mechanical Properties VII, edited by Gerberich, W.W., Gao, H., Sundgren, J.-E., and Baker, S.P. (Mat. Res. Soc. Symp. Proc. 436, Pittsburgh, PA 1996) pp.Google Scholar
[4] Flinn, P.A., Gardner, D.S. und Nix, W.D., IEEE Trans. on Elec. Devices, ED–34, 689 (1987)Google Scholar
[5] Venkatraman, R. und Bravman, J.C., J. Mater. Res. 7, 2040 (1992)Google Scholar
[6] Bader, S., Flinn, P.A., Arzt, E. und Nix, W.D., J. Mater. Res. 9, 318 (1994)Google Scholar
[7] Ogawa, H., Suzuki, K., Kaneko, S., Nakano, Y., Ishikawa, Y. und Kitahara, T., Microsystem Technologies, 117 (1997)Google Scholar
[8] Weihs, T.P., Hong, S., Bravman, J.C. und Nix, W.D., J. Mat. Res. 3, 931 (1988)Google Scholar
[9] Schweitz, J.-Å., MRS Bulletin XVII (7), 34 (1992)Google Scholar
[10] Baker, S.P. und Nix, W.D., J. Mater. Res. 9, 3131 (1994)Google Scholar
[11] Knauß, M., PhD thesis, Universität Stuttgart, 1996 Google Scholar
[12] Ewalds, H.L. and Wanhill, R.J.H. in Fractures Mechanics (E. Arnold, Kent, UK 1991) p.49 Google Scholar
[13] Nix, W.D., Met. Trans. A 20, 2217 (1989)Google Scholar
[14] Thompson, C.V. (private communication).Google Scholar