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Measureme of Soiderability Performance of IC Lead/Leadfinish Sysrems Using the Weiting Baiance

Published online by Cambridge University Press:  21 February 2011

Janice Wittmershaus ,
N. Grayeli ,
J. Siemimann  and
E. Vickers
Janice Wittmershaus
Affiliation:
Intel Corporation, 145 S. 79th Street, Chandler, AZ 85226
N. Grayeli
Affiliation:
Intel Corporation, 145 S. 79th Street, Chandler, AZ 85226
J. Siemimann
Affiliation:
Intel Corporation, 145 S. 79th Street, Chandler, AZ 85226
E. Vickers
Affiliation:
Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, MA 02139
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Abstract

A critical investigation of the use of the wetting balance to characterize leadfinish solderability is described. The wetting force vs. time curves for matte tin and solder plated copper coupons which have been subjected to well controlled environmental conditions, such as steam and high temperature bakes have been analyzed. Steam exposure was shown to impact greatly the shape of the wetting force curve, with the major effect observed after one hour of exposure and with no significant changes upon further exposure. The high temperature exposure (bake) and associated intermetallic compound formation had little effect on the force-time curve as long as it was protected from oxidation. Results show that when the wetting balance is used in conjunction with SEM and microanalysis tools, it is an excellent diagnostic tool for determining sources of solderability changes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 453
Copyright
Copyright © Materials Research Society 1989

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References

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