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Manufacturing and Technology Requirements for Submicron Multilevel Metal

Published online by Cambridge University Press:  25 February 2011

T. E. Seidel
T. E. Seidel*
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, TX 78741
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Extract

Multilevel Metal (MLM) technology has been driven by the need for ever faster switching speed. In the simplest considerations, this need has been described by the RC time constant applied to the metal interconnect runner embedded in a dielectric medium:

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 260: Symposium C – Advanced Metallization and Processing for Semiconductor Devices and Circuits , 1992 , 3
Copyright
Copyright © Materials Research Society 1992

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References

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