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Low TCE Polyimides from Polyamic Acid Blends and Copolymers: Preparation and Characterization Studies

Published online by Cambridge University Press:  15 February 2011

Krishna G. Sachdev ,
Sandra Graham-Ode ,
Thomas L. Nunes  and
Paul S. Ho
Krishna G. Sachdev
Affiliation:
IBM, General Technology Division, Hopewell Junction, NY
Sandra Graham-Ode
Affiliation:
IBM, General Technology Division, Hopewell Junction, NY
Thomas L. Nunes
Affiliation:
IBM, General Technology Division, Hopewell Junction, NY
Paul S. Ho
Affiliation:
University of Texas at Austin, Austin TX
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Abstract

A series of polyimides prepared from BPDA-PDA and BTDA-PDA polyamic acid blends and the corresponding (BPDA-PDA)x-(BTDA-PDA)y copolymers have been investigated for the mechanical properties, the thermal expansion, and the residual stress in films cured on silicon wafers. To determine the effect of inclusion of a highly flexible chain segment into BPDA-PDA structure, a BPDA-PDA/BDAF copolyimide has also been characterized. The experimental data are correlated with the chemistry and the composition of the blends and the copolyimides.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 91
Copyright
Copyright © Materials Research Society 1992

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