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Laser-Induced Fluorescence Diagnostics of CF4/O2/H2 Plasma Etching*
Published online by Cambridge University Press: 15 February 2011
Abstract
Laser-induced fluorescence experiments have been carried out during CF4/O2/H2 plasma etching of Si and SiO2. Measurements of relative CF2 radical concentrations as a function of rf power, frequency, pressure, and gas composition are reported. The results are correlated with etch rates of Si and SiO2. The balance between CF2 and F concentrations is shown to influence the etching process strongly.
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- Copyright © Materials Research Society 1983
Footnotes
This work was sponsored by the Department of the Air Force, in part with specific funding from the Air Force Office of Scientific Research.
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