Hostname: page-component-7bb8b95d7b-s9k8s Total loading time: 0 Render date: 2024-10-05T20:31:31.022Z Has data issue: false hasContentIssue false

Laser Recrystallized Polysilicon on Sio2 For High Performance Resistors

Published online by Cambridge University Press:  15 February 2011

Rajiv R. Shah
Affiliation:
Texas Instruments Incorporated, Semiconductor Research and Development Laboratories, P.O. Box 225012, Dallas, Texas, 75265
D. Randy Hollingsworth
Affiliation:
Texas Instruments Incorporated, Semiconductor Research and Development Laboratories, P.O. Box 225012, Dallas, Texas, 75265
D. Lloyd Crosthwait
Affiliation:
Texas Instruments Incorporated, Semiconductor Research and Development Laboratories, P.O. Box 225012, Dallas, Texas, 75265
Get access

Abstract

We demonstrate, for the first time, a technique for the fabrication of polysilicon resistors with excellent control and temperature characteristics: a standard deviation of 2.5 Ω/□ and temperature variation of -5.6% from 25° to 125°C for 1.96kΩ/□, 4.5 × 1014 cm˗2 boron implanted polysilicon resistors. The technique is based on fabricating resistors in laser recrystallized polysilicon on SiO2. Resistor performance is compared to that of similar resistors fabricated in standard LPCVD polysilicon and in single crystal silicon.

Type
Research Article
Copyright
Copyright © Materials Research Society 1982

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Kamins, T.I., “Hall mobility in chemically deposited polycrystalline silicon,” J. Appl. Phys., vol. 42, pp. 43574365, 1971.Google Scholar
2. Cowher, M. E. and Sedgwick, T. O., “Chemical vapor deposited polycrystalline silicon,” J. Electrochem. Soc., vol. 119, pp. 15651570, 1972.Google Scholar
3. Rai-Chowdhury, P. and Hower, P. L., “Growth and characterization of polycrystalline silicon,” J. Electrochem. Soc., vol. 120, pp. 17611766, 1973.Google Scholar
4. Seto, J. Y. W., “The electrical properties of polycrystalline silicon films,” J. Appl. Phys., vol. 46, pp. 52475254, 1975.Google Scholar
5. Mandurah, M. M., Saraswat, K. C., and Kamins, T. I., “Phosphorous doping of low-pressure chemically vapor deposited silicon films,” J. Electrochem. Soc., vol. 126, pp. 10191023, 1979.Google Scholar
6. Lu, N. C. C., Gerzberg, L., and Meindl, J. D., “A quantitative model of the effect of grain size on the resistivity of polycrystalline silicon resistors,” Elect. Device Lett., EDL-1 no. 3, pp. 3841, 1980.Google Scholar
7. Lu, N. C. C., Gerzberg, L., Lu, C. Y., and Meindl, J. D., “A new conduction model for poly-crystalline silicon films,” Elect. Device Lett., EDL-2, no. 4, pp. 9598, 1981.Google Scholar
8. Shah, R. R. and Crosthwait, D. L., “Pulsed laser recrystallization of polysilicon: analysis via a novel SEM technique,” in Laser and Electron Beam Solid Interactions and Materials Processing, Gibbons, J. F., Hess, L. D., and Sigmon, T. W., eds., Elsevier North Holland, Inc., pp. 471478, 1981.Google Scholar