Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-20T04:06:52.205Z Has data issue: false hasContentIssue false

Ir Thin Films for PZT Capacitors Prepared by MOCVD Using a New Ir Precursor

Published online by Cambridge University Press:  01 February 2011

H. Fujisawa
Affiliation:
Department of Electrical Engineering and Computer Sciences, Graduate School of Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji, Hyogo 671–2201, Japan
S. Watari
Affiliation:
Department of Electrical Engineering and Computer Sciences, Graduate School of Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji, Hyogo 671–2201, Japan
M. Shimizu
Affiliation:
Department of Electrical Engineering and Computer Sciences, Graduate School of Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji, Hyogo 671–2201, Japan
H. Niu
Affiliation:
Department of Electrical Engineering and Computer Sciences, Graduate School of Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji, Hyogo 671–2201, Japan
N. Oshima
Affiliation:
Tokyo Research Center, TOSOH Corporation, 2743–1, Hyakawa, Ayase, Kanagawa 252–1123, Japan
Get access

Abstract

Preparation of Ir thin films for PZT capacitors by MOCVD using a new liquid Ir precursor, Ir(EtCp)(CHD) was investigated. Ir thin films with a highly reflecting surface and (111)-orientation were successfully obtained at 230–400 C. When Ir(EtCp)(CHD) was used, shorter incubation time (20min at 230°C and not observed above 240°C) and higher nucleation density (300–400mm-2 at 250–300°C) were observed because of its lower decomposition temperature (300°C) than that of previously reported liquid precursor, Ir(EtCp)(COD). Resistivity of 100nm-thick Ir films grown at 250–350°C were less than 20μΩ·cm. PZT capacitors with top and bottom electrodes prepared using Ir(EtCp)(CHD) showed D-E hysteresis loop with Pr of 15μC/cm and Ec of 60kV/cm. No degradation of switching up to 10 switching cycles by bipolar pulses of ±231kV/cm (±3V) and 500kHz.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Nakamura, T., Nakao, Y., Kamisawa, A. and Takasu, H., Appl. Phys. Lett., 65, 1522 (1994).Google Scholar
2. Nakamura, T., Nakao, Y., Kamisawa, A. and Takasu, H., Jpn. J. Appl. Phys., 33, 5207 (1994).Google Scholar
3. Hoke, J.B., Stern, E.W. and Murry, H.M., J. Mater. Chem., 1, 551 (1991).Google Scholar
4. Dey, S.K., Goswami, J., Wang, C-G. and Majhi, P., Jpn. J. Appl. Phys., 38, L1052 (1999).Google Scholar
5. Sun, Y.-M., Yan, X.-M., Mettlach, N., Endle, J.P., Kirch, P.D., Ekerdt, J.G., Madhukar, S., Hance, R.L. and White, J.M., J. Vac. Sci. Technol., A18, 10 (2000).Google Scholar
6. Gelfond, N.V., Tuzikov, F.V. and Igumenov, I.K., Thin Solid Films, 227, 144 (1993).Google Scholar
7. Vergas, R., Goto, T., Zhang, W. and Hirai, T., Appl. Phys. Lett., 65, 1094 81994).Google Scholar
8. Sun, Y.-M., Endle, J.P., Smith, K., Whaley, S., Mahaffy, R., Ekerdt, J.G., White, J.M. and Hance, R.L., Thin Solid Films, 346, 100 (1999).Google Scholar
9. Gerfin, T., Halg, W.J., Atamny, F. and Dahmen, K., Thin Solid Films, 241, 352 (1993).Google Scholar
10. Xu, C., Dimeo, F. Jr, Baum, T.H. and Russel, M., Mater. Res. Soc. Symp. Proc., 541, 129 (1999).Google Scholar
11. Shimizu, M., Kita, K., Fujisawa, H., Tomozawa, N. and Niu, H., Proc. 12th IEEE Int. Symp. Applications of Ferroelectrics, pp.961964 (2000).Google Scholar
12. Shimizu, M., Kita, K., Fujisawa, H. and Niu, H., Mater. Res. Soc. Symp. Proc., 655, CC1.10.1 (2001).Google Scholar
13. Fujisawa, H., Kita, K., Shimizu, M. and Niu, H., Jpn. J. Appl. Phys., 40, 5551 (2001).Google Scholar
14. Oshima, N., Kawano, K., Takamori, M., Yamakawa, T., Watari, S., Fujisawa, H., Shimizu, M. and Niu, H., Abs. of 204th ECS Meeting, Vol. 2003–2, 554 (2003).Google Scholar
15. Kawano, K., Takamori, M., Tada, K., Yamakawa, T., Watari, S., Fujisawa, H., Shimizu, M., Niu, H. and Oshima, N., submitted to Mater. Res. Soc. Symp. Proc., 762, C3.30 (2004).Google Scholar