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Ion Jimplantation to Inhibit Corrosion of Copper
Published online by Cambridge University Press: 15 February 2011
Abstract
Ion implantation of boron and aluminium is used to passivate copper surfaces. Such a process modifies the copper only near its surface without affecting copper's desirable bulk properties. The present experiments show that implant doses as low as 1015 ions/cm2 of either boron or aluminium can reduce the oxidization rate by one order of magnitude or more compared to non-implanted samples.
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- Copyright © Materials Research Society 1992