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Investigation of Potential Diffusion Barriers Between YBa2Cu3O7-x and Silicon

Published online by Cambridge University Press:  28 February 2011

A. Lubig
Affiliation:
Institut für Schicht- und Ionentechnik, KFA Jülich, P. O. Box 1913, D–5170 Jülich, Fed. Rep. of Germany
Ch. Buchal
Affiliation:
Institut für Schicht- und Ionentechnik, KFA Jülich, P. O. Box 1913, D–5170 Jülich, Fed. Rep. of Germany
W. Zander
Affiliation:
Institut für Schicht- und Ionentechnik, KFA Jülich, P. O. Box 1913, D–5170 Jülich, Fed. Rep. of Germany
B. Stritzker
Affiliation:
Institut für Schicht- und Ionentechnik, KFA Jülich, P. O. Box 1913, D–5170 Jülich, Fed. Rep. of Germany
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Abstract

Thin films of ZrO2, BaF2, and noble metals on TiN have been examined by RBS as potential diffusion barriers between Si(100) substrates and high-temperature superconductors. As best result so far, a buffer layer of 260 nm ZrO2 enabled the growth of a 230 nm film of YBa2Cu3O7-x, which had been deposited by laser ablation. The relatively low zero resistance temperature of about 60 K may result from some interdiffusion between YBaCuO components and the ZrO2 layer or from holes in the film. A 520 nm BaF2 layer was able to prevent Si outdiffusion towards the surface, when exposed to an oxidizing ambient at typical YBa2Cu3O7-x deposition temperatures between 750 and 800°C. A strong reaction between YBaCuO components and BaF2, however, resulted in non-superconducting films. At high temperatures in oxidizing ambient the noble metal/TiN/Si samples suffered severely from oxidation and surface roughening.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

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