Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-29T07:40:30.475Z Has data issue: false hasContentIssue false

Intrinsic Gettering of Iron in Czochralski Silicon Crystals

Published online by Cambridge University Press:  03 September 2012

M. Aoki
Affiliation:
Fujitsu Laboratories Ltd., 10–1 Morinosato-Wakamiya, Atsugi 243–01, Japan
A. Hara
Affiliation:
Fujitsu Laboratories Ltd., 10–1 Morinosato-Wakamiya, Atsugi 243–01, Japan
A. Ohsawa
Affiliation:
Fujitsu Laboratories Ltd., 10–1 Morinosato-Wakamiya, Atsugi 243–01, Japan
Get access

Abstract

We present a new experimental approach to studying the mechanism of intrinsic gettering of Fe in Czochralski silicon crystals. We present our experimental method and results for as-grown and intrinsic gettered wafers with high and low-level Fe surface contamination. We found that when annealing at the Fe supersaturation temperature, Fe concentration decreases faster in intrinsic gettered wafers than in as-grown wafers. Concentration saturated with annealing time for each sample and the saturated Fe concentration followed a simple Arrhenius relationship. Re-emission of Fe from the bulk defect region occurred above the gettering temperature. We conclude that in intrinsic gettering, Fe precipitates preferentially in the bulk defect region when the Fe impurities supersaturate as temperature drops.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Gilles, D., Weber, E. R., and Hahn, S., Phys. Rev. Lett. 6 4, 196 (1990).CrossRefGoogle Scholar
2. Weber, E. R. and Gilles, D., Proc. 6th Int. Symp. Silicon Materials Science and Technology, Montreal, 1990 (Electrochemical Society, Pennington, 1990) p. 585.Google Scholar
3. Aoki, M., Hara, A., and Ohsawa, A., Extended Abstracts of the 1991 Int. Conf. Solid State Devices and Materials, Yokohama, 1991 (Business Center for Academic Societies Japan, Tokyo, 1991) p. 59.Google Scholar
4. Aoki, M., Hara, A., and Ohsawa, A., Jpn. J. Appl. Phys. 30, 3580 (1991).Google Scholar
5. 1978 Annual Book of ASTM Standards, Part 43 (American Society for Testing Materials, Philadelphia, 1978), F12176.Google Scholar
6. Shimura, F., Semiconductor Silicon Crystal Technology (Academic Press Inc., San Diego, New York, Berkeley, Boston, London, Sydney, Tokyo, Toronto, 1989) p. 364.Google Scholar
7. Shimazaki, A., Hiratsuka, H., Matsushita, Y., and Yoshii, S., Extended Abstracts 16th Int. Conf. Solid State Devices and Materials, Kobe, 1984 (Business Center for Academic Societies Japan, Tokyo, 1984) p. 281.Google Scholar
8. Lang, D. V., J. Appl. Phys. 45, 3023 (1974).CrossRefGoogle Scholar
9. Graff, K. and Pieper, H., J. Electrochem. Soc. 128, 669 (1981).Google Scholar
10. Kimering, L. C. and Benton, J. L., Physica B 116, 297 (1983).Google Scholar
11. Nakashima, H., Isobe, T., Yamamoto, Y., and Hashimot, K., Jpn. J. Appl. Phys. 27, 1542 (1988).CrossRefGoogle Scholar
12. Secco d'Aragona, F., J. Electrochem. Soc. 119, 948 (1972).Google Scholar
13. Weber, E. R., Appl. Phys. A 30, 1 (1983)Google Scholar