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Interfacial Properties, Surface Morphology and Thermal Stability of Epitaxial GaAs on Ge Substrates with High-k Dielectric for Advanced CMOS Applications

Published online by Cambridge University Press:  01 February 2011

A Kumar
Affiliation:
[email protected], Nanyang Technological University, School of EEE, Singapore, Singapore
G K Dalapati
Affiliation:
[email protected], IMRE A*STAR, Singapore, Singapore
Terence Kin Shun Wong
Affiliation:
[email protected]@gmail.com, Nanyang Technological University, Singapore, Singapore
M K Kumar
Affiliation:
[email protected], IMRE A*STAR, Singapore, Singapore
C K Chia
Affiliation:
[email protected], IMRE A*STAR, Singapore, Singapore
H Gao
Affiliation:
[email protected], IMRE A*STAR, Singapore, Singapore
B Z Wang
Affiliation:
[email protected], IMRE A*STAR, Singapore, Singapore
A S Wong
Affiliation:
[email protected], IMRE A*STAR, Singapore, Singapore
D Z Chi
Affiliation:
[email protected], IMRE A*STAR, Singapore, Singapore
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Abstract

Epitaxial GaAs layers had been grown by metal organic chemical vapor deposition at 620°C on Ge(100) susbtrates. The surface roughness of the GaAs is greater than that of GaAs bulk wafers and epilayer morphology is influenced by miscut of the Ge substrate. The GaAs/Ge interface is of good quality and devoid of misfit dislocations and antisite defects. However, Ge diffusion into GaAs occurred during epitaxy and resulted in auto-doping. ZrO2 was deposited by magnetron sputtering onto the epi-GaAs. Capacitance voltage measurements show that the TaN/ZrO2/epi-GaAs capacitor has an interfacical with more defects than a ZrO2/bulk GaAs interface. An improved interface with smaller frequency dispersion can be formed by atomic layer deposition of the high-k dielectric layer onto the epi-GaAs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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References

1 Thompson, S.E. Chau, R.S. Ghani, T. Mistry, K. and Tyagi, S. IEEE Trans. Semicond. Manu. 18, 26 (2005).Google Scholar
2 Heyns, M. and Tsai, W. MRS Bull. 34, 485 (2009).Google Scholar
3 Gong, Y. Ng, C.M. and Wong, T.K.S. J. Electrochem. Soc. 156, H948 (2009).Google Scholar
4 Ren, F. Hong, M. Hobson, W.S. Kuo, J.M. Lothian, J.R. Mannaerts, J.P. Kwo, J. Chu, S.N.G. Chen, Y.K. and Cho, A.Y. Solid-State Electron. 41, 1751 (1997).Google Scholar
5 Ye, P.D. Wilk, G.D. and Frank, M.M. Processing and Characterization of III-V Compound Semiconductor MOSFETs Using Atomic Layer Deposited Gate Dielectrics, Advanced Gate Stacks for High-Mobility Semiconductors, ed. Dimoulas, A. Gusev, E. McIntyre, P.C. and Heyns, M. (Springer, 2007) pp. 341361.Google Scholar
6 Tsai, W. Goel, N. Kovershnikov, S. Majhi, P. and Wang, W. Microelect. Eng. 86, 1540 (2009).Google Scholar
7 Xuan, Y. Wu, Y.Q. and Ye, P.D. IEEE Elect. Dev. Lett. 29, 294 (2008).Google Scholar
8 Passlack, M. Droopad, R. Rajagopalan, K. Abrokwah, J. Zurcher, P. Hill, R. Moran, D. Li, X. Zhou, H. MacIntyre, D. Thoms, S. Thayne, I. Dig. CS MANTECH Conf. Austin TX, 2007 pp. 235238.Google Scholar
9 Sze, S.M. Physics of Semiconductor Devices, (Wiley, 1981) pp. 850851.Google Scholar
10 Chui, C.O. and Saraswat, K.C. Germanium Nanodevices and Technology, Advanced Gate Stacks for High-Mobility Semiconductors, ed. Dimoulas, A. Gusev, E. McIntyre, P.C. and Heyns, M. (Springer, 2007) pp. 293313.Google Scholar
11 Degraeve, R. Cartier, E. Kauerauf, T. Carter, R. Pantisano, L. Kerber, A. and Groseneken, G. MRS Bull. 27, 222 (2002).Google Scholar
12 Dalapati, G.K. Kumar, M.K. Chia, C.K. Gao, H. Wang, B.Z. Wong, A.S.W. Kumar, A. Chiam, S.Y., Pan, J.S. and Chi, D.Z. J. Electrochem. Soc. 157, H825 (2010).Google Scholar