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Interdiffusion in Polyimide Thin Films

Published online by Cambridge University Press:  25 February 2011

E. J. Kramer ,
W. Volksen  and
T. P. Russell
E. J. Kramer
Affiliation:
Department of Materials Science and the Materials Science Center, Cornell University, Ithaca, NY 14850
W. Volksen
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
T. P. Russell
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
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Abstract

The interdiffusion in thin films of polyimide has been investigated using the forward recoil spectrometry (FRES) technique. Films 5–10 μm in thickness of polyamic acid spin coated onto a silicon substrate were imidized at a temperature TI. A second film, ∼300Å in thickness of perdeuterated polyamic acid was spin-coated onto the first layer and heated to a temperature TD to allow interdiffusion of the two films and imidization of the second coating. Depth profiling of the deuterated polymer by FRES showed that no interdiffusion occurred if TI>TD and TI>200°C. Substantial interdiffusion occurred if TD>TI and TI<400° C. Time averaged tracer diffusion coefficients were found to vary with the TD and TI, as well as the length of time allowed for interdiffusion. Since conversion of the deuterated polyamic acid to polyimide occurs at the diffusion temperature, the results are consistent with a relatively large diffusion coefficient for the polyamic acid (D>2.5× 10−14 cm2/sec) which decreases to a negligible value as the molecule is fully converted to the corresponding polyimide.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 195
Copyright
Copyright © Materials Research Society 1986

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