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In-Situ Tem Investigation During Thermal Cycling of thin Copper Films

Published online by Cambridge University Press:  15 February 2011

R.-M. Keller ,
W. Sigle ,
S. P. Baker ,
O. Kraft  and
E. Arzt
R.-M. Keller
Affiliation:
Max-Planck-Institut ffir Metallforschung and Institut für Metallkunde, University of Stuttgart Seestr. 71, D-70174 Stuttgart, Germany
W. Sigle
Affiliation:
Max-Planck-Institut ffir Metallforschung and Institut für Metallkunde, University of Stuttgart Seestr. 71, D-70174 Stuttgart, Germany
S. P. Baker
Affiliation:
Max-Planck-Institut ffir Metallforschung and Institut für Metallkunde, University of Stuttgart Seestr. 71, D-70174 Stuttgart, Germany
O. Kraft
Affiliation:
Max-Planck-Institut ffir Metallforschung and Institut für Metallkunde, University of Stuttgart Seestr. 71, D-70174 Stuttgart, Germany
E. Arzt
Affiliation:
Max-Planck-Institut ffir Metallforschung and Institut für Metallkunde, University of Stuttgart Seestr. 71, D-70174 Stuttgart, Germany
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Abstract

In-situ transmission electron microscopy (TEM) was performed to study grain growth and dislocation motion during temperature cycles of Cu films with and without a cap layer. In addition, the substrate curvature method was employed to determine the corresponding stresstemperature curves from room temperature up to 600°C. The results of the in-situ TEM investigations provide insight into the microstructural evolution which occurs during the stress measurements. Grain growth occurred continuously throughout the first heating cycle in both cases. The evolution of dislocation structure observed in TEM supports an explanation of the stress evolution in both capped and uncapped films in terms of dislocation effects.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 221
Copyright
Copyright © Materials Research Society 1997

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References

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