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In-situ Observation of the Formation and Growth of Twin in the Copper Electrodeposits for Ultra Large Scale Integration

Published online by Cambridge University Press:  01 February 2011

Heung Nam Han ,
Hyo-Jong Lee ,
Do Hyun Kim ,
Ui-hyoung Lee ,
Pil-Ryung Cha  and
Kyu Hwan Oh
Heung Nam Han
Affiliation:
[email protected], Seoul National University, Material Science and Engineering, San 56 -1, Shinrim -dong, Kwanak -gu, Seoul, 151-742, Korea, Republic of, +82-2-880-9240, +82-2-885-9671
Hyo-Jong Lee
Affiliation:
[email protected], Seoul National University, Material Science and Engineering, San 56-1, Shinrim-dong, Kwanak-gu, Seoul, 151-744, Korea, Republic of
Do Hyun Kim
Affiliation:
[email protected], Seoul National University, Material Science and Engineering, San 56-1, Shinrim-dong, Kwanak-gu, Seoul, 151-744, Korea, Republic of
Ui-hyoung Lee
Affiliation:
[email protected], Seoul National University, Material Science and Engineering, San 56-1, Shinrim-dong, Kwanak-gu, Seoul, 151-744, Korea, Republic of
Pil-Ryung Cha
Affiliation:
[email protected], Kookmin University, School of Advanced Materials Engineering, 861-1, Chongnung-dong, Songbuk-gu, Seoul, 136-702, Korea, Republic of
Kyu Hwan Oh
Affiliation:
[email protected], Seoul National University, Material Science and Engineering, San 56-1, Shinrim-dong, Kwanak-gu, Seoul, 151-744, Korea, Republic of
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Abstract

During the self-annealing in the copper electrodeposits for the copper metallization, an in-situ observation of grain growth of the copper at room temperature was performed by using EBSD (electron backscatter diffraction). The thin film structure of the copper electrodeposits after annealing was columnar. New twin was initiated at the front surface of growing twin and grew along the normal direction of the twin boundary between the new and parent twins. It was confirmed that the annealing twin in the copper electrodeposits during the self-annealing have an {111} growth front surface.

Keywords

microstructurecrystal growthCu
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F06-04
Copyright
Copyright © Materials Research Society 2006

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