Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-25T17:27:20.416Z Has data issue: false hasContentIssue false
  • English
  • Français

In-Situ Observation of Grain Boundary Behavior in Ni3 Al Alloys During Tensile Deformation in Sem

Published online by Cambridge University Press:  26 February 2011

Dongliang Lin  and
Da Chen
Dongliang Lin
Affiliation:
Shanghai Jiao Tong University, Shanghai, China
Da Chen
Affiliation:
Shanghai Jiao Tong University, Shanghai, China
Get access

Abstract

The deformation behavior of Ni3Al alloys with various chemical compositions and subjected to different heat treatments were in-situ observed in SEN. Moreover, in-situ observations of slip trace are supplemented by the direct observation of dislocation arrangements by TEM. In boron-doped Ni3Al alloys it is shown that close to the grain boundary there exists a thin slip transition region, within which slip lines are reoriented or other slip systems are operated to produce a local strain accommodation and to relax the stress concentration at grain boundaries. However, boron-enhenced ductility is seriously affected by alloy stoichiometry, the addition of a tertiary alloy element and heat treatment, etc.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 133: Symposium H – High-Temperature Ordered Intermetallic Alloys III , 1988 , 217
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] “Proceeding of Symposium on High Temperature Ordered Intermetallic Alloys”, eds. Koch, C.C., Liu, C.T. and Stoloff, N.S., MRS, 1985 and 1987.Google Scholar
[2] Stoloff, N.S., Int. Met. Rev., 29(1984),123.Google Scholar
[3] Lin, C.T., White, C.L. and Horton, J.A., Acta Metall., 33(1985),213.Google Scholar
[4] Aoki, K. and Izumi, O., Nippon Kinzoku Gakkaishi, 43(1979),1190.Google Scholar
[5] Liu, C.T., White, C.L., Koch, C.C. and Lee, E.H., in “Proc. Symp. High Temperature Materials Chemisty - II”, eds. Munir and Cubicciotti. The Electrochemical Soc., 1983.Google Scholar
[6] Taub, A.I., Huang, S.C. and Chang, K.M., Metall.Trans. A, 5A(1984),399.CrossRefGoogle Scholar
[7] Liu, C.T. and White, C.L., Proc. Materials Research Society Symposium on “High Temperature Ordered Intermetallic Alloy”, Boston, MA, Nov.26–30, 1984, Vol.39, pp365–380.Google Scholar
[8] Shulson, E.M., Weihs, T.P., Baker, I., Frost, H.J. and Horton, J.A., Scripta Metall., 19(1985),1497.Google Scholar
[9] Baker, I., Schulson, E.M. and Horton, J.A., Acta Metall., 35(1987),1533.Google Scholar
[10] Shulson, E.M., Weihs, T.P., Baker, I., Frost, H.J. and Horton, J.A., Acta Metall., 34(1986),1395.CrossRefGoogle Scholar
[11] Bond, G.M., Robertson, I.M., and Birnbaum, H.K., J.Mater.Res. 2(1987),436.Google Scholar
[12] Brandon, B.G. and Wald, M., Phil. Mag., 6(1961), 1035.CrossRefGoogle Scholar