Hostname: page-component-cd9895bd7-7cvxr Total loading time: 0 Render date: 2024-12-27T01:46:08.632Z Has data issue: false hasContentIssue false

In-Situ Crystallization and Doping of a-Si Film by Means of Spin-On-Glass

Published online by Cambridge University Press:  15 February 2011

Tomoyuki Sakoda
Affiliation:
Dept. of Physical Electronics, Tokyo Institute of Technology2–12–1 Oh-okayama, Meguro-ku, Tokyo 152, Japan.
Chang-Dong Kim
Affiliation:
Dept. of Physical Electronics, Tokyo Institute of Technology2–12–1 Oh-okayama, Meguro-ku, Tokyo 152, Japan.
Masakiyo Matsumura
Affiliation:
Dept. of Physical Electronics, Tokyo Institute of Technology2–12–1 Oh-okayama, Meguro-ku, Tokyo 152, Japan.
Get access

Abstract

A novel technique has been proposed for selective and in -situ excimer-laser crystallization and doping to thin poly-Si films. Dopant atoms are supplied, during the Si laser crystallization process, to the Si film on glass from the doped SOG (spin-on-glass) film coated on the top. Conductivity of the processed film was increased to more than 10S/cm from about 10−8S/cm of the starting film. This technique has been applied to the bottom gate amorphous-Si TFTs with self-aligned poly-Si source and drain. The electron field-effect mobility was 1.0cm2/Vs and the on/off current ratio was more than 106. No parasitic effects were observed, and the hole conduction was effectively. This in-situ crystallization and doping technique can also be applied to the top gate a-Si TFT process.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kawai, S., Komada, T., et al., Proc. Society for Information Display, 25, 21 (1984).Google Scholar
2. Chenevas-Paule, A., et al., Proc. Society for Information Display, 26, 197 (1985).Google Scholar
3. Sugiura, O., Kim, C.D. and Matsumura, M., Electronics Lett., 29, 750 (1993).Google Scholar
4. Kim, C.D., Sugiura, O. and Matsumura, M. in Amorphous Silicon Technology, edited by Schiff, E.A. et al.(Mater.Res.Soc.Proc. 297 1993)pp.925.Google Scholar
5. Kim, C.D. and Matsumura, M., Display Manufacturing conf.(SID, San Francisco, Jan. 1994).Google Scholar
6. Carey, P.G., Sigmon, T.W., et al., IEEE Electron Device Lett., 6, 291 (1985).Google Scholar
7. Sameshima, T., Usui, S., Jpn. J. Appl. Phys., 26, L1208 (1987).Google Scholar
8. Kodera, H., Jpn. J. Appl. Phys., 53, 3702 (1963).Google Scholar
9. Sze, S. M., Physics of Semiconductor Devices(John Wiley & Sons,New York,1981), p.68.Google Scholar
10. Shimizu, K., Sugiura, O. and Matsumura, M., Jpn. J. Appl. Phys., 29, L1775 (1990).Google Scholar
11. Kanoh, H., et al., IEEE Electron Device Lett., 11, 258 (1990).Google Scholar
12. Uchida, Y., Kanoh, H. et al., Jpn. J. Appl. Phys., 29, L2171 (1990).Google Scholar
13. Sameshima, T. in Microcrystalline Semiconductors:Materials Science & Devices, edited by Fauchet, P.M., et al.(Mater. Res. Soc. Proc. 283 1993)pp.679.Google Scholar