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In-Situ Chronoamperometry for CMP Slurry Investigations

Published online by Cambridge University Press:  01 February 2011

Jian Zhang ,
Steven Grumbine ,
Phillip W. Carter  and
Thomas Werts
Jian Zhang
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
Steven Grumbine
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
Phillip W. Carter
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
Thomas Werts
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
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Abstract

A new application of the electrochemical method, in situ chronoamperometry, has been developed and used as a tool for CMP slurry characterization. The measured current response, i, resulting from a small applied potential is fit to an exponential equation, i = io + A1exp(-t/tD). The fitting parameters serve as a measure of surface reactivity (io), surface film robustness (A1), and the kinetics of film formation (tD). A description of the method and correlations to polishing performance are discussed in this paper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W7.3
Copyright
Copyright © Materials Research Society 2005

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References

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