Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-05T15:58:26.015Z Has data issue: false hasContentIssue false

In-Situ Chemical Concentration control cor Wafer Wet Cleaning

Published online by Cambridge University Press:  10 February 2011

Ismail Kashkoush
Affiliation:
SubMicron Systems Corporation, 6330 Hedgewood Dr. #150, Allentown, PA 18106
Eric Brause
Affiliation:
SubMicron Systems Corporation, 6330 Hedgewood Dr. #150, Allentown, PA 18106
Richard Novak
Affiliation:
SubMicron Systems Corporation, 6330 Hedgewood Dr. #150, Allentown, PA 18106
Robert Grant
Affiliation:
SubMicron Systems Corporation, 6330 Hedgewood Dr. #150, Allentown, PA 18106
Get access

Abstract

The continuously increasing integration of today's advanced semiconductors requires increasingly tight process control in the IC manufacturing steps. This paper demonstrates the use of conductivity sensors to monitor and control the chemical concentrations of RCA cleaning and HF etching solutions. Electrodeless conductivity sensors were used to monitor and regulate the concentration of these process chemicals. A linear relationship between the conductivity of the solution and the chemical concentration was obtained within the range studied. A chemical monitoring and concentration scheme (ICE-1™) was developed. Different concentrations of RCA and HF solutions were investigated. Results show that these techniques are suitable for monitoring and controlling the concentration of chemicals in the process tanks for better process control. These techniques provide a lower cost of ownership of the process due to longer bath lives and the use of dilute chemicals.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Kern, W. and Puotinen, D.A., RCA Review, 31, 1970, pp. 187206.Google Scholar
2. Kern, W., Handbook Semiconductor Wafer Cleaning Technology, Noyes, 1993, pp. 367.Google Scholar
3. Ruska, W. S., Microelectronic Processing, McGraw-Hill, 1987, pp. 9151.Google Scholar
4. Kashkoush, I., Rajaram, B., Carrillo, F., Novak, R., and Grant, R., Proc. ECS Meeting and Conf., 4th Wafer Cleaning Symp., Chicago, IL, Oct 8–13, 1995, pp. 429–435.Google Scholar
5. Kashkoush, I., SMS Technical Report, March/April 1996.Google Scholar
6. Pelletier, M.J., Davis, K.L., and Carpio, R.A., Semiconductor International, March 1996, pp. 103–108.Google Scholar
7. Giguere, P.A., and Chen, H., J. Raman Spectr., 15, 1984, pp. 199.CrossRefGoogle Scholar
8. Kaigawa, H., Yamamoto, K., and Shigematsu, Y., Jpn. J. Appl. Phys., 33, part 2, 1994, pp. 4080.Google Scholar
9. Kashkoush, I., SMS Technical Report, June/July 1995.Google Scholar
10. Ryuta, R., Yoshimi, T., Kondo, H., Okunda, H., and Shimanuki, Y., Jpn. J. App. Phys. 31, part 2, 1992, pp. 2338.CrossRefGoogle Scholar
11. Kashkoush, I., Branse, E., Grant, R., and Novak, R., Particulate Removal from Silicon Substrates in Megasonic-Assisted Dilute SC1 Chemistry, this proceedings.Google Scholar