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Influence of the structure on the mechanical properties of electrodeposited metallic thin films

Published online by Cambridge University Press:  15 February 2011

J.-L. Delplancke
Affiliation:
Metallurgy - Electrochemistry Department, CP165
R. Winand
Affiliation:
Metallurgy - Electrochemistry Department, CP165
J. Dille
Affiliation:
Physical Metallurgy, CP194/03 Université Libre de Bruxelles, 50 Avenue F.D. Roosevelt, B-1050 Bruxelles, Belgium
J. Charlier
Affiliation:
Physical Metallurgy, CP194/03 Université Libre de Bruxelles, 50 Avenue F.D. Roosevelt, B-1050 Bruxelles, Belgium
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Abstract

Production of thin (10 to 200 microns thick) metallic (Cu, Co and Ni-P) foils is performed by electrodeposition on various substrates. A competition between substrate-induced and electroplating-induced inhibition of crystal growth appears. Film structures observed by SEM, TEM and X-Ray diffraction are related to the mechanical properties of the films (stress-strain curves, microhardness and work hardening bend test).

In some cases, copper thin films with a large number of submicron crystals are obtained. These films recrystallize at room temperature and their mechanical properties are completely modified by this ageing process.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

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