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Influence of the structure on the mechanical properties of electrodeposited metallic thin films
Published online by Cambridge University Press: 15 February 2011
Abstract
Production of thin (10 to 200 microns thick) metallic (Cu, Co and Ni-P) foils is performed by electrodeposition on various substrates. A competition between substrate-induced and electroplating-induced inhibition of crystal growth appears. Film structures observed by SEM, TEM and X-Ray diffraction are related to the mechanical properties of the films (stress-strain curves, microhardness and work hardening bend test).
In some cases, copper thin films with a large number of submicron crystals are obtained. These films recrystallize at room temperature and their mechanical properties are completely modified by this ageing process.
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- Copyright © Materials Research Society 1993
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