Hostname: page-component-745bb68f8f-grxwn Total loading time: 0 Render date: 2025-02-05T14:27:12.120Z Has data issue: false hasContentIssue false
  • English
  • Français

The Influence of Strengthening Mechanisms on Stress Relaxation in Thin Aluminum Metallization

Published online by Cambridge University Press:  15 February 2011

Jonathan Gorrell ,
Paul Holloway  and
Hal Jerman
Jonathan Gorrell
Affiliation:
Dept. of Materials Science & Engineering, University of Florida 32611–6400
Paul Holloway
Affiliation:
Dept. of Materials Science & Engineering, University of Florida 32611–6400
Hal Jerman
Affiliation:
EG&G IC Sensors, 1701 McCarthy Blvd., Milpitas, CA 95035.
Get access

Abstract

With the development of microelectromechanical systems there is a need for stronger aluminum thin films that resist stress relaxation. A number of strengthening mechanisms are used extensively for bulk aluminum alloys, but very few have been used to improve the performance of thin films. Pure aluminum, standard microelectronicsmetallization (A1-.04Cu-.017Si), alloy T201 (Al-.046Cu-.006Ag-.004Mn-.003Mg-.003Ti), and alloy 2090 (Al-.026Cu-.021Li-.001Zr) were electron beam evaporated or sputter deposited onto (100) silicon substrates.. Stress versus temperature and stress relaxation were measured in the films. Pure aluminum and AlSiCu alloy films exhibited plastic deformation at low stresses and low temperatures. The T201 and 2090 films exhibited residual elastic stresses at room temperature of 350 MPa and 500 MPa, and did not plastically deform until 240°C at 100 MPa stress, or 270°C at 200 MPa stress, respectively. The T201 film also showed a low stress relaxation rate. We speculate that solid solution strengthening caused the increase in strength of the T201 film, and that age hardening caused the increase in strength of the 2090 film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 27
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Riethmüiller, Werner and Benecker, Wolfgang, IEEE Transactions on Electron Devices, VOL. 35, NO. 6 (June 1988).Google Scholar
2. Timoshenko, S., J.Opt. Soc. Am. and R.S.I., VOL. 11, (Sept. 1925), pp. 233–55.Google Scholar
3. Pionke, C. D. and Wempner, G., Journal of Applied Mechanics, Transactions of the ASME, VOL. 58, (Dec. 1991), pp.1015–20Google Scholar
4. Barth, P. W., Solid State Sensor and Actuator Workshop, Hilton Head, June 1994, pp. 248–50Google Scholar
5. Jerman, Hal, J. Micromech. Microeng., 4, p. 210–6, (1994).Google Scholar
6. Korhonen, , Scripta Metallurgica, VOL. 24, (1990), pp. 2297–2302.Google Scholar
7. Draper, B. L. and Hill, T. A., J. Vac. Sci. Tech., 139 (4), (July 1991), pp. 1956–62.Google Scholar
8. Brooks, Charlie R., Heat Treatment, Structure and Properties of Nonferrous Alloysf, American Society for Metals, Metals Park, Ohio, 1982, pp. 1–137.Google Scholar
9. Pollock, Daniel D., Electrical Conduction In Solids An Introduction, American Society for Metals, Metals Park, Ohio, 1995, pp. 125–40.Google Scholar
10. Hummel, Rolf E., Electronic Properties of Materials, 2nd Edition, Springer-Verlag, New York, 1992, pp. 84–8.Google Scholar
11. Brooks, Charlie R., Heat Treatment, Structure and Properties of Nonferrous Alloys, American Society for Metals, Metals Park, Ohio, 1982, pp. 275–85.Google Scholar
12. Ohring, Milton, The Materials Science of Thin Films, Academic Press, Inc., New York, 1992, pp. 415–8.Google Scholar
13. Metals Handbook, VOL.2, Properties and Selection: Nonferrous Alloys and Special Purpose Materials, Tenth Edition, pp. 152–3.Google Scholar
14. Metals Handbook, VOL.v2, Properties and Selection: Nonferrous Alloys and Special Purpose Materials, Tenth Edition, pp.178–99.Google Scholar