Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-27T01:55:47.869Z Has data issue: false hasContentIssue false

The Influence of an In-Situ Electric Field on H+ and He+ Implantation Induced Defects in Silicon

Published online by Cambridge University Press:  22 February 2011

J. Ravi
Affiliation:
Department of Materials Science & Engineering, North Carolina State University, Raleigh, NC 27695-7916
Yu. Erokhin
Affiliation:
Department of Materials Science & Engineering, North Carolina State University, Raleigh, NC 27695-7916
S. Koveshnikov
Affiliation:
Department of Materials Science & Engineering, North Carolina State University, Raleigh, NC 27695-7916
G.A. Rozgonyi
Affiliation:
Department of Materials Science & Engineering, North Carolina State University, Raleigh, NC 27695-7916
C.W. White
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN 37831-6057, USA.
Get access

Abstract

The influence of in-situ electronic perturbations on defect generation during 150 keV proton implantation into biased silicon p-n junctions has been investigated. The concentration and spatial distribution of the deep traps were characterized using a modification of the double corelation deep level transient spectroscopy technique (D-DLTS). With the in-situ electric field applied, a decrease in concentration of vacancy-related, as well as H-related, traps was observed. 500 keV He+ implantation was also performed to supplement the above studies and to differentiate any passivation effects due to hydrogen. A model based on the charge states of hydrogen and vacancies was used to explain the observed behaviour.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Kimmerling, L. C., Solid State Electronics 21, 1391 (1978).Google Scholar
2 Kimmerling, L. C., Blood, P. and Gibson, W. M. Inst. Phys. Conf. Ser 46, 273 (1979).Google Scholar
3 Irmsher, K., Klose, H. and Maass, K., J. Phys. C. 17, 6317 (1984).Google Scholar
4 Hüppi, M. W., J. Appl. Phys. 68, 2702 (1990).Google Scholar
5 Schroder, D. K., Semicnductor Material and Device Characterization, (John Wiley & Sons, New York, 1990), p.325.Google Scholar
6 Lefevre, H. and Schulz, M., Appl. Phys. 12, 45 (1977).Google Scholar
7 Kimmerling, L. C., Radiation Effects in Semiconductors (Inst. Phys. London) Conf. Ser. 31, p.221, 1977 Google Scholar
8 Palmetshofer, L. and Reisinger, J., J. Appl. Phys. 72, 2167 (1992).Google Scholar
9 Qin, G. G. and Hua, Zh. L., Solid State Commun. 53, 975 (1985).Google Scholar
10 Hallen, A., Sundqvist, B. U. R., Paska, Z., Svenson, B. G., Rosling, M. and Tiren, J., J. Appl. Phys. 67, 1266 (1990).Google Scholar
11 Tavendale, A. J., Pearton, S. J. and Williams, A. A., Appl. Phys. Lett. 56, 949 (1990).Google Scholar
12 Zhu, J., Johnson, N. M., Herring, C. Phys. Rev. B 41, 12354 (1990).Google Scholar
13 Van de Walle, C. G., Bar-Yam, Y., Pantelides, S. T., Phys. Rev B. 38, 9643 (1988).Google Scholar
14 Corbett, J. W. and Watkins, G. D., Phys. Rev. 138, 555 (1965).Google Scholar
15 Asghar, M., Zafar Iqbal, M. and Zafar, N., J. Appl. Phys. 73, 8, 1993.Google Scholar