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Indentation Characterization of Fracture Toughness and Interfacial Strength of PECVD Nitrides after Rapid Thermal Annealing

Published online by Cambridge University Press:  01 February 2011

H-Y Yan ,
K-S Ou  and
K-S Chen
H-Y Yan
Affiliation:
[email protected], National Cheng-Kung University, Mechanical Engineering, 1 University Rd., Tainan, 70101, Taiwan
K-S Ou
Affiliation:
[email protected], National Cheng-Kung University, Mechanical Engineering, 1 University Rd., Tainan, 70101, Taiwan
K-S Chen
Affiliation:
[email protected], National Cheng-Kung University, Mechanical Engineering, 1 University Rd., Tainan, 70101, Taiwan
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Abstract

This work presents the result of mechanical characterization of the fracture toughness and interfacial strength of PECVD silicon nitride films deposited on silicon subjected to rapid thermal annealing (RTA) processing between 200 and 800 °C. Both micro- and nano-indentation techniques are employed to perform the experiments. In conjunction with the model proposed by Marshall and Lawn for data reduction, the fracture toughness of un-heat treated nitride is obtained as 2.2 MPa√m based on a series of Vickers micro-indentation tests and this value is essentially unchanged if the RTA temperatures are below 400°C. Further increase in RTA temperature would significantly enhance the fracture toughness. On the other hand, using nanoindentation testing in conjunction with the model proposed by Marshall and Evans, the interfacial strength between the nitride and silicon is determined as 17.2 J/m2 for un-heat treatment nitrides and it could also be significantly enhanced by RTA processes with temperatures exceeding 400°C. These results should be useful for related MEMS or IC structure fabrication for the concerns of maintaining the structural integrity and improve fabrication performance in related applications.

Keywords

microelectro-mechanical (MEMS)nitridetoughness
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD02-06
Copyright
Copyright © Materials Research Society 2008

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References

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