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Improved Rinse Quench for a more Uniform Etch of Thermal Oxide in Buffered Oxide Etch (BOE)

Published online by Cambridge University Press:  10 February 2011

T. B. Parry
T. B. Parry*
Affiliation:
R & D Department, SCP Global Technologies, 400 N Benjamin Ln., Boise, ID 83704
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Abstract

An improved method for quenching a Buffered Oxide Etch (BOE) process in a DI water overflow rinse tank is shown. Many different factors were investigated in several preliminary experiments. Most of these factors were thought to influence etch uniformity yet proved not to be significant. The transfer process from chemical to rinse was identified as contributing negatively to etch uniformity. A chemical carryover layer formed during the transfer process was identified as the most significant factor. The hydrodynamics of liquids are outlined to help explain how the carryover layer is formed and shaped. Several sensitivity analysis experiments show transfer speeds to significantly affect carryover layer thickness and uniformity. Slow transfer speeds are determined to produce consistent and improved uniformity. Results of a follow up experiment quantify the uniformity improvement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 477 , 1997 , 465
Copyright
Copyright © Materials Research Society 1997

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References

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