Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-29T07:43:25.252Z Has data issue: false hasContentIssue false

Improved Electrical Performance of a-Si:H Thin Film Transistors, TFTs with n+ (μc-Si Contact, and Silicon Oxide and Nitride Dual-Layer Dielectrics

Published online by Cambridge University Press:  01 January 1993

S.S. He
Affiliation:
Departments of Physics, Materials Science and Engineering, Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27695-8202, USA
D.J. Stephens
Affiliation:
Departments of Physics, Materials Science and Engineering, Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27695-8202, USA
G. Lucovsky
Affiliation:
Departments of Physics, Materials Science and Engineering, Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27695-8202, USA
Get access

Abstract

We report the use of heavily-doped n-type μc-Si as a source and drain contacts in a-Si:H TFTs. Dual-layer dielectrics comprised of SiO2 and Si3N4 layers are employed, and the back channel regions are passivated to prevent depletion region formation. We have compared the electrical performance of TFTs with n+ a-Si source and drain contacts and n+ μc-Si source and drain contacts, relating some differences in performance to the properties of the source and drain materials. In addition we discuss the fabrication and performance of TFT structures that include B-compensated i-μc-Si channel regions and heavily-doped n+ μc-Si source and drain contacts.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Suzuki, K., "Flat panel displays using amorphous and microcrystalline semiconductor devices" in Amorphous and microcrystalline semiconductor Devices, Ed. Kanicki, J., Boston: (Artech House, Boston, 1991), p.77.Google Scholar
[2] He, S.S., Stephens, D.J., Lucovsky, G. and Ramaker, R.W., MRS Symp. Proc. 284 (1993).Google Scholar
[3] Lucovsky, G.. Wang, C., Williams, M.J. and Maher, D.M., MRS Symp. Proc. 286 (1993).Google Scholar
[4] He, S.S., Stephens, D.J., Ramaker, R.W. and Lucovsky, G., MRS Symp. Proc. 282 (1993).Google Scholar
[5] Spear, W.E., Willeke, G., LeComber, P.G. and Fitzgerald, A.G.. J. Physique 42, C4, 257 (1981).Google Scholar
[6] Lucovsky, G., Wang, C. and Chen, Y.L, J. Vac. Sci. Technol. A10, 2025 (1992).Google Scholar
[7] Veprek, S., Sarott, F.A. and Iqbal, Z., Phys. Rev. 36, 3344 (1987).Google Scholar
[8] Veprek, S., MRS Symp. Proc. 164, 39 (1989).Google Scholar
[9] Chen, Y.L., Wang, C., Lucovsky, G., Maher, D.M. and Nemanich, R.J.., J. Vac. Sci. Technol. A10, 874 (1992).Google Scholar