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The Importance Of Pairing Reactions For The Modeling Of Defect-Dopant Interactions In Silicon

Published online by Cambridge University Press:  10 February 2011

I. Bork
Affiliation:
Semiconductors, Munich, Germany
A. v. Schwerin
Affiliation:
Semiconductors, Munich, Germany
Siemens AG
Affiliation:
Semiconductors, Munich, Germany
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Abstract

In this article it is shown that the reactions between dopants and point defects in silicon are slow enough to play a significant role for low temperature transient enhanced diffusion (TED). As a consequence, diffusion models based on the assumption of local equilibrium between dopants and dopant-defect pairs highly overestimate TED at temperatures below 800°C. Without this assumption, i.e. when full dynamic pairing of dopants is included in simulations, good agreement to experimental results is achieved.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1. Rafferty, C., Proc. of SISPAD'97, 1, 1997.Google Scholar
2. Stolk, P.A., Gossmann, H.-J., Eaglesham, D.J., Jacobson, D.C., Rafferty, C.S., Gilmer, G.H. Jaraiz, M., Poate, J.M., Luftman, H.S., Haynes, T.E., J. Appl. Phys., 81, 9, 6031, 1997.Google Scholar
3. Dunham, Sc.T., ”A Quantitative Model for the Coupled Diffusion of Phosphorus and Point Defects in Silicon”, J. Electrochem. Soc., 139 (9), 2628, 1992.Google Scholar
4. Dunham, Sc.T., VPAD Tech. Dig.'93, 46, 1993.Google Scholar
5. Bork, I., Matsumoto, H., Proc. of SISPAD'96, 91, 1996.Google Scholar
6. Poate, J.M., Eaglesham, D.J., Gilmer, G.H., Gossmann, H.-J., Jarafz, M., Rafferty, C.S. and Stolk, P.A., IEDM Tech. Dig.'95, 77, 1995.Google Scholar
7. Giles, M.D., J. Electrochem. Soc., 138 (4), 1160, 1991.Google Scholar
8. TSUPREM4 Version 6.5, User's Manual, TMA Inc., 1997.Google Scholar
9. PROMIS 1.6 User's Guide, Hobler, G., Pichler, P., Wimmer, K., Inst. for Microelectronics, TU Vienna, 1991.Google Scholar
10. Yoshida, M., Jap. J. Appl. Phys., 18 (3), 479, 1979.Google Scholar
11. Yoshida, M., Arai, E., Nakamura, H. and Terunuma, Y., J. Appl. Phys., 45 (4), 1498, 1974.Google Scholar
12. Matsumoto, S., Yoshida, M., Niimi, T., Jap. J. Appl. Phys., 33 (11), 1899, 1974.Google Scholar
13. Rafferty, C.S., Gilmer, G.H., Jaraiz, M., Eaglesham, D., and Gossmann, H.-J., Appl. Phys. Lett., 68 (17), 2395, 1996.Google Scholar
14. Rafferty, C.S. (private communication).Google Scholar