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Impact of planarization sheet addition on full wafer printing uniformity

Published online by Cambridge University Press:  01 February 2011

Tanguy Leveder
Affiliation:
[email protected], CEA\LETI - Minatec, D2NT, 17, rue des martyrs, Grenoble, France, 33 4 38 78 26 29
Stefan Landis
Affiliation:
[email protected], CEA\LETI - Minatec, 17, rue des martyrs, Grenoble, N/A, France
Laurent Davoust
Affiliation:
laurent;[email protected], ENSHMG-LEGI, Grenoble, N/A, France
Nicolas Chaix
Affiliation:
[email protected], CNRS\LTM, 17, rue des martyrs, Grenoble, N/A, France
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Abstract

Uniformity of nanoimprint lithography has been quantitatively studied through the ability to replicate regular lines arrays by wafer-to-wafer imprint. Two statistic coefficients have been defined in order to quantify the local uniformity and the ability to identically imprint two similar areas respectively. Those coefficients enable to compare different imprint profiles in terms of uniformity and to point out the efficiency of soft layers insertion into the imprint stack.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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References

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