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Imaging of III-V Compound Superlattices by Hrem and Rem

Published online by Cambridge University Press:  26 February 2011

B. C. De Cooman
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca NY 14853
J. R. Conner
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca NY 14853
S. R. Summerfelt
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca NY 14853
S. McKernan
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca NY 14853
C. B. Carter
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca NY 14853
J. R. Shealy
Affiliation:
Electronics Laboratory, GE Corporation, Syracuse NY and School of Electrical Engineering, Cornell University, Ithaca NY 14853
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Abstract

Two techniques for the analysis of III-V compound superlattices are examined. It has been proposed that high-resolution TEM of [100]-oriented thin foils would give an improvement in layer contrast compared with [110]-oriented thin foils; it is shown here that the contrast of [100]-oriented superlattices is not necessarily better. Moreover, both high resolution and conventional dark-field imaging may be subject to significant diffraction contrast effects resulting from the bending of the reflecting planes near the surface of the sample. Reflection electron microscopy (REM) of cross-sectional (110) cleavage planes can also yield dark-field superlattice images and selected area RHEED patterns can in principle be used to determine reliably the superlattice strain as surface effects are minimized.

Type
Articles
Copyright
Copyright © Materials Research Society 1987

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References

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