Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-25T18:03:11.407Z Has data issue: false hasContentIssue false

Identification of the Microscopic Structure of New Hot Carrier Damage Centers in Short Channel Mosfets

Published online by Cambridge University Press:  10 February 2011

C. A. Billman
Affiliation:
The Pennsylvania State University, University Park, PA 16802
P. M. Lenahan
Affiliation:
The Pennsylvania State University, University Park, PA 16802
W. Weber
Affiliation:
Siemens Corporate Research and Development, ZTME2 D-81739 Munich Germany
Get access

Abstract

We show, for the first time, that E'like centers can be generated in hot hole stressing of short channel metal oxide silicon field effect transistors (MOSFETs). Prior to this study only Pb centers had been directly linked to this stressing phenomenon.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCE

1 Ning, T.H., Cook, P.W., Dennard, R.H., Osburn, C.M., Schuster, S.E., and Yu, H.N., IEEE Trans., Ed 26, 346 (1979).Google Scholar
2 Groseneken, G., Maes, H.E., Beltran, N., and Dekeersmaecker, R.F., IEEE Trans., Ed 31, 42 (1984).Google Scholar
3 Heremans, P., Maes, H.E., and Saks, N., IEEE Elee. Dev. Lett., 7, 428 (1986).Google Scholar
4 Weber, W. and Brox, M., Microelectronic Eng., 19, 453 (1992).Google Scholar
5 Krick, J.T., Xenahan, P.M., and Dunn, G.J., Appl. Phys. Lett., 59, 3437 (1991).Google Scholar
6 Gabrys, J.W., Lenahan, P.M., and Weber, W., Microelectronic Eng., 22, 273 (1993).Google Scholar
7 Lenahan, P.M. and Dressendorfer, P.V., Appl. Phys. Lett., 41 542 (1982).Google Scholar
8 Xenahan, P.M. and Dressendorfer, P.V., Appl. Phys. Lett., 44, 96 (1984).Google Scholar
9 Lenahan, P.M. and Dressendorfer, P.V., J. Appl. Phys., 55, 3495 ( 1984).Google Scholar
10 Lenahan, P.M. and Jupina, M.A., Colloids and Surfaces, 42, 191 (1990).Google Scholar
11 Stathis, J.H. and DiMaria, D.J., Appl. Phys. Lett., 61, 2887 (1992).Google Scholar
12 Cartier, E., Stathis, J.H., and Buchanan, D.A., Appl. Phys. Lett., 63, 1510 (1993).Google Scholar
13 Stathis, J.H. and Cartier, E., Phys. Rev. Lett., 72, 2745 (1994).Google Scholar
14 Caplan, P.J., Poindexter, E.H., Deal, B.E., and Razoak, R.R., J. Appl. Phys., 50, 5847 (1979).Google Scholar
15 Jupina, M.A. and Xenahan, P.M., IEEE Trans. Nucl. Sci., 37, 1650 (1990).Google Scholar
16 Brower, K.L., Appl. Phys. Lett., 43, 1111 (1983).Google Scholar
17 Cantin, J.X., Schoisswohl, M., von Barteleben, H.J., Morazzani, V., Ganem, J.J., and Trimaille, I., in The Physics and Chemistry of SiO2 and Si-SiO2 Interface III, Massoud, H. Z., Poindexter, E. H., and Helms, C. R. eds, The Electrochemical Society Pennington, NJ (1996) p28.Google Scholar
18 Lenahan, P.M. and Dressenderfer, P.V., IEEE Trans. Nucl. Sci., 29, 1459 (1982).Google Scholar
19 Lenahan, P.M. and Dressenderfer, P.V., IEEE Trans. Nucl. Sci., 30, 4602 (1983).Google Scholar
20 Miki, H., Noguchi, M., Yokogawa, K., Kim, B., Asada, I.C., and Sugano, T., IEEE Trans. Elec. Dev., 35, 2245 (1988).Google Scholar
21 Takahashi, T., Trplett, B.B., Yokogawa, K., and Sugano, T., Appl. Phys. Lett., 26, 1334 (1987).Google Scholar
22 Xipkin, L., Rowan, L., Reisman, A., and Williams, C.K., J. Electrochem Soc, 138, 2050 (1991).Google Scholar
23 Awazu, K., Watanabe, K., and Kawazoe, K., J. Appl. Phys., 2054 (1993).Google Scholar
24 Conley, J.F. Jr, Lenahan, P.M., and Roitman, P., IEEE Trans. Nucl. Sci., 38, 1247 (1991).Google Scholar
25 Warren, W.L., Lenahan, P.M., Robinson, B., and Stathis, J.H., Appl. Phys. Lett., 53, 482 (1988).Google Scholar
26 Conley, J.F. Jr, Lenahan, P.M., Lelis, A.J., and Oldham, T.R., Appl. Phys. Lett., (1995).Google Scholar
27 Conley, J.F. Jr, Lenahan, R.M., and Roitman, P., Appl. Phys. Lett., 60, 2889 (1992).Google Scholar
28 Conley, J.F. Jr, Lenahan, P.M., and Roitman, P., IEEE Trans. Nucl. Sci., 39, 2114 (1992).Google Scholar
29 Vanheusden, K. and Stesmans, A., Appl. Phys. Lett., 62, 2405 (1993).Google Scholar
30 Warren, W.L., Shaneyfelt, M.R., Schwank, J.R., Fleetwood, D.M., Winokur, P.S., Devine, R.A.B., Mazara, W.P., and McKitterick, J.B., IEEE Trans. Nucl. Sci., 40, 1755 (1993).Google Scholar
31 Conley, J.F. and Xenahan, P.M., IEEE Trans. Nucl. Sci., 42, 1740 (1995).Google Scholar
32 Conley, J.F. and Lenahan, P.M., Microelectronic Eng., 28, 35 (1995).Google Scholar
33 Zhang, L. and Leisure, R.G., J. Appl. Phys., 80, 3744 (1996).Google Scholar