Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-17T15:18:05.036Z Has data issue: false hasContentIssue false

Hydrogen Radical Etching Effect on Carbon Nanotube Growth

Published online by Cambridge University Press:  01 February 2011

Hiroshi Nagayoshi
Affiliation:
[email protected], Tokyo National College of Technology, 1220-2, Kunygida-machi, Hachoji, Tokyo, 1938610, Japan, +81-4268-5392
Hiroaki Sato
Affiliation:
[email protected], Shonan Institute of Technology, Japan
Suzuka Nishimura
Affiliation:
[email protected], Shonan Institute of Technology, Japan
Kazutaka Terashima
Affiliation:
[email protected], Shonan Institute of Technology, Japan
Get access

Abstract

The hydrogen microwave remote plasma CVD was introduced to fabricate carbon nanotubes(CNTs). C2H2 or CH4, used as source gas react with hydrogen radicals introduced from the cavity. In this experiment, hydrogen radical etching effect on the substrate surface could be controlled independently. We confirmed CNTs growth at 400°C under adequate hydrogen radical etching effect on the substrate surface. The result directly suggests that the etching effect of hydrogen radicals on the reaction surface contribute to the low temperature growth of CNTs. The CNT thickness did not depend on the hydrogen radical etching effect but the catalyst layer thickness.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[4] Tollefson, E. L. and Le Roy, D. J.The Reaction of Atomic Hydrogen with AcetyleneThe Journal of Chemical Physics 16, pp.10571062(1948)Google Scholar
[1] Iijima, S.: Nature 354(1991)56 Google Scholar
[2] Teo, K. B. K., Chhowalla, M., Amaratunga, G. A. J., Milne, W. I., Pirio, G., Legagneux, P., Pribat, D. and Hasako, D. G.: Appl. Phys. Lett. 80(2002)2011.Google Scholar
[3] Hayashi, Y., Negishi, T. and Nishimoto, S.: J. Vac. Sci. & Technol. A 19(2001) 1796.Google Scholar
[4] Balooch, M. and Olander, D. R.: J. Chem. Phys., 63, 4772(1975) 5.Google Scholar