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Growth and Structure of Metallic Barrier Layers and Interconnect Films II: Atomistic Simulations of Film Deposition onto Inclined Surfaces
Published online by Cambridge University Press: 10 February 2011
Abstract
We present three dimensional lattice Monte Carlo simulations of sputter deposition onto inclined surfaces. For this purpose, we use a model of an fcc material and we vary the substrate inclination, the texture, and the atomic mobility. In this way we can examine different conditions and mechanisms involved in depositing barrier layer and interconnect films. We obtain results on the density and the roughness of the films. We find that the film texture has dramatic effects on the film density and smoothness. Surprisingly, we find that the surface diffusion coefficients may not be critical parameters; changes in the coefficients by several orders of magnitude may cause only a small change in the film morphology when depositing onto non-wetting substrates.
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- Copyright © Materials Research Society 1999
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