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Growth and Characterization of Layered Structures of Silicon Carbide and Aluminum Nitride

Published online by Cambridge University Press:  25 February 2011

B. S. Sywe
Affiliation:
Department of Chemical Engineering, Kansas State University, Manhattan, KS 66506.
Z. J. Yu
Affiliation:
Department of Chemical Engineering, Kansas State University, Manhattan, KS 66506.
J. H. Edgar
Affiliation:
Department of Chemical Engineering, Kansas State University, Manhattan, KS 66506.
J. Chaudhuri
Affiliation:
Mechanical Engineering Department, The Wichita State University, Wichita, KS 67208.
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Abstract

Heterostructures of SiC and AlN in either sequence, AlN on SiC or SiC on AlN, were grown on Si, Al2O3, and 6H-SiC substrates by (metalorganic) chemical vapor deposition (CVD). On Si substrates, a SiC layer was first grown by a two-step technique and an AlN layer was deposited subsequently. On other substrates, an AlN layer was first grown, followed by SiC deposition. Multi-layered structures (SiC/AlN/SiC) were also produced to demonstrate the ability of heteroepitaxy of SiC and AlN on each other.

AlN grown on 3C-SiC were highly oriented polycrystalline films. AlN films on 6H-SiC, SiC films on A1N/Al2O3, and SiC films on AlN/6H-SiC were single crystal. In the latter two cases, the SiC films were in hexagonal structure. These SiC films were smooth and specular in appearance and showed n-type conductivity.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1. Edmond, J.A., Kong, H.-S., and Carter, C.H., to be published in Amorphous and Crystalline Silicon Carbide IV, edited by Yang, C.Y.-W., Rahman, M.M., and Harris, G.L. (Springer-Verlag, Heidelberg).Google Scholar
2. Fujieda, S., Mizuta, M., and Matsumoto, Y., Jpn. J. Appl. Phys. 27, L296 (1988).Google Scholar
3. Hasegawa, F., Takahashi, T., Kubo, K., Ohnari, S., Nannichi, Y., and Arai, T., Jpn. J. Appl. Phys. 26, L1448 (1987).Google Scholar
4. Akasaki, I., Amano, H., Hiramatsu, K., and Sawaki, N., Inst. Phys. Conf. Ser. No. 91, 80 (1988).Google Scholar
5. Gaskill, D. K., Bottka, N., and Lin, M. C., J. Cryst. Growth 77, 418 (1986).Google Scholar
6. Sywe, B.S., Yu, Z.J., and Edgar, J.H., in Wide Band Gap Semiconductors, edited by Moustakas, T.D., Pankove, J.I., and Hamakawa, Y. (Mater. Res. Soc. Symp. Proc. 242, Pittsburgh, PA, 1992) pp. 463467.Google Scholar
7. Powell, J. A., Matus, L. G., and Kuczmarski, M. A., J. Electrochem. Soc. 134, 1557 (1987).Google Scholar
8. Sywe, B.S., Yu, Z.J., Burckhard, S., Edgar, J.H., and Chaudhuri, J., to be presented at the Twelfth International Conference on Chemical Vapor Deposition (CVD XII), Electrochemical Society Meeting, Honolulu, HI, May 1993.Google Scholar
9. Freitas, J.A. Jr, and Bishop, S.G., in Diamond, Silicon Carbide and Related Wide Bandgap Semiconductors, edited by Glass, J.T., Messier, R., and Fujimori, N. (Mater. Res. Soc. Symp. Proc. 162, Pittsburgh, PA, 1990) pp. 495499.Google Scholar