Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-27T17:26:55.704Z Has data issue: false hasContentIssue false

A Gate Breakdown Mechanism in Mesfets and HEMTs

Published online by Cambridge University Press:  15 February 2011

R. J. Trew
Affiliation:
Electrical and Computer Engineering Department, North Carolina State University, Raleigh, NC 27695-7911
T. A. Winslow
Affiliation:
Electrical and Computer Engineering Department, North Carolina State University, Raleigh, NC 27695-7911
U. K. Mishra
Affiliation:
Electrical and Computer Engineering Department, University of California at Santa Barbara, Santa Barbara, CA 93106
Get access

Abstract

A model for gate breakdown in MESFETs and HEMTs is proposed. The model is based upon a combination of thermally assisted tunneling and avalanche breakdown. When thermal effects are considered it is demonstrated that the model predicts increasing drain-source breakdown as the gate electrode is biased towards pinch-off, in agreement with experimental data. The model also predicts, for the first time, the gate current versus bias behavior observed in experimental data. The model is consistent with the various reports of breakdown and light emission phenomena reported in the literature.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]Frensley, W.R., ”Power-Limiting Breakdown Effects in GaAs MESFETs,” IEEE Trans. Electron Dev., vol. ED–28, pp. 962970, Aug. 1981.10.1109/T-ED.1981.20467Google Scholar
[2]Fukuta, M., Mimura, T., Suzuki, H., and Suyama, K., ”4-GHz, 15-W Power GaAs MESFET,” IEEE Trans. Electron Dev., vol. ED–25, pp. 559563, June 1978.Google Scholar
[3]Yamamoto, R., Higashisaka, A., and Hasegawa, F., ”Light Emission and Burnout Characteristics of GaAs Power MESFETs,” IEEE Trans. Electron Dev., vol. ED–25, pp. 567573, June 1978.Google Scholar
[5]Tsironis, C., ”Prebreakdown Phenomena in GaAs Epitaxial Layers and FETs,” IEEE Trans. Electron Dev., vol. ED–27, pp. 277282, Jan. 1980.10.1109/T-ED.1980.19850Google Scholar
[6]Furutsuka, T., Tsuji, T., and Hasegawa, F., ”Improvement of the Drain Breakdown Voltage of GaAs Power MESFETs by a Simple Recess Structure,” IEEE Trans. Electron Dev., vol. ED–25, pp. 563567, June 1978.Google Scholar
[7]Tserng, H.Q., Frensley, W.R., and Saunier, P., ”Light Emission of GaAs Power MESFETs Under RF Drive,” IEEE Electron Dev. Lett., vol. EDL–1, pp. 2021, Feb. 1980.10.1109/EDL.1980.25214Google Scholar
[8]Yin, L.W., Hwang, Y., Lee, J.H., Kolbas, R.M., Trew, R.J., and Mishra, U.K., ”Improved Breakdown Voltage in GaAs MESFETs Utilizing Surface Layers of GaAs Grown at a Low Temperature by MBE,” IEEE Electron Dev. Lett., vol.11, pp. 561563, Dec. 1990.10.1109/55.63040Google Scholar
[9]Chen, C.L.. Smith, F.W., Clifton, B.J., Mahoney, L.J., Manfra, M.J., and Calawa, A.R., ”High Power-Density GaAs MISFETs with a Low- Temperature-Grown Epitiaxial Layer as the Insulator,” IEEE Electron Dev. Lett., vol.12, pp. 306308, June 1991.Google Scholar
[10]Smith, F.W., Chen, C.L., Mahoney, L.J., Manfra, M.J., Temme, D.H., Clifton, B.J., and Calawa, A.R., ”A 1.57 W/mm GaAs-Based MISFET for High-Power and Microwave-Switching Applications,” 1991 IEEE MTT-S International Microwave Symposium Digest, pp. 643–646.Google Scholar
[11]Padovani, F.A. and Stratton, R., ”Field and Thermionic-Field Emission in Schottky Barriers,” Solid-State Electronics, vol.9, pp. 695707, July 1966.10.1016/0038-1101(66)90097-9Google Scholar
[12]Mizuta, H., Yamaguchi, K., and Takahashi, S., ”Surface Potential Effects of Gate-Drain Avalanche Breakdown in GaAs MESFETs,” IEEE Trans. Electron Dev., vol. ED–34, pp. 20272033, Oct. 1987Google Scholar