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Friction and Wear of Amorphous Hydrogenated Carbon

Published online by Cambridge University Press:  15 February 2011

S. L. Heidger*
Affiliation:
National Aeronautics and Space Administration, Lewis Research Center, Cleveland Ohio 44135
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Abstract

Uniform amorphous hydrogenated carbon (a-C:H) films with surface roughnesses ranging between 1 nm and 4 nm were produced by radio frequency self biased plasma enhanced chemical vapor deposition (rf PECVD) on > Silicon substrates using 100% methane precursor gas mixture, rf power densities ranging between 0.11 W/cm2 and 1.07 W/cm2, and pressures ranging between 0.67 Pa and 40 Pa. Reciprocating sliding friction experiments were conducted on the a-C:H films with hemispherical, silicon nitride pins in dry nitrogen and in 60% relative humidity. The coefficients of friction and the wear rates of the a-C:H were very low in dry nitrogen, ranging from 0.03 to 0.05, and from 1.1 × 108 mm3/Nm to 2.3 × 10−6 mm3/Nm, respectively. In 60% relative humidity, the initial coefficients of friction were approximately 0.30. However, the steady state coefficients of friction of the a-C:H films ranged from 0.10 and 0.30, depending on the deposition conditions. The wear rates ranged from 2.0 × 10−9 mm3/Nm to 8.9 x 10−8 mm3/Nm in 60% relative humidity. Raman microprobe spectroscopy and Auger electron spectroscopy (AES) revealed that sliding friction was transforming the a-C:H films into a material primarily composed of sp2 bonded carbon with increasing short range order. Qualitatively, the amount of wear which occurred corresponded to the extent that the structural changes progressed. The a-C:H films were further characterized by scanning electron microscopy (SEM) and surface profilometry.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

(1) Angus, J.C., Koidl, P. and Domitz, S., in Plasma Deposited Thin Films, Mort, J. and Jansen, F. eds., Ch.4 (CRC Press, 1986) 89.Google Scholar
(2) Miyoshi, K., Adv. Info. Storage Syst., Vol.3, (Amer. Soc. of Mech. Engrs. 1991) 147.Google Scholar
(3) Miyoshi, K., Wu, R.L.C. and Garscadden, A., Surf. & Coat. Technol., 54/55 (1992) 428.Google Scholar
(4) Memming, R., Tolle, H.J. and Wierenga, P.E., Thin Solid Films, 143 (1986) 31.Google Scholar
(5) Agarwal, S., Li, E. and Heiman, N., IEEE Trans. on Magnetics, 29(1) (1993) 264.Google Scholar
(6) Lee, J.K., Smallen, M., Enguero, J., Lee, H.J. and Chao, A., IEEE Trans. on Magnetics, 29(1) (1993) 276.Google Scholar
(7) Angoni, K., Carbon, 31 (4) (1993) 537.Google Scholar
(8) Nemanich, R.J., Glass, J.T., Lucovsky, G. and Shroder, R.E., J. Vac. Sci. Technol.,A 6 (3) (1988) 1783.Google Scholar
(9) Knight, D.S. and White, W.B., J. Mater. Res., 4(2) (1989) 385.Google Scholar
(10) Rossi, F., Andre, B.', vanVeen, A., Mijnarends, P.E., Schut, H., Delplaneke, M.P., Gissler, W., Haupt, J., Lucazeau, G. and Abello, L., J. Appl. Phys., 75 (6) (1994) 3121.Google Scholar
(11) Huong, P.V., Diam. & Rel. Mat., 1 (1991) 33.Google Scholar
(12) Nemanich, R.J. and Solin, S.A., Phys. Rev. B, 20 (2) (1979) 392.Google Scholar
(13) Enke, K., Dimigen, H. and Hubsch, H., Appl. Phys. Lett. 36 (1980) 291.Google Scholar
(14) McKenzie, D.R., McPhedran, B.C., Savvides, N. and Cockayne, D.J.H., Thin Solid Films, 108 (1983) 247.Google Scholar
(15) Dischler, B., Bubenzer, A. and Koidl, P., Solid State Commun., 48 (1983) 105.Google Scholar
(16) Robertson, J., Advances in Physics, 35 (4) (1986) 317.Google Scholar
(17) Lurie, P.G. and Wilson, J.M., Surf. Sci., 65 (1977) 476.Google Scholar
(18) Pepper, S.V., Appl. Phys. Lett., 38 (1981) 344.Google Scholar
(19) Bonnot, A.M., Surf. Coat. Technol., 45 (1991) 343.Google Scholar
(20) Ramaker, D.E., Phys. Ser., T41 (1992) 77.Google Scholar
(21) Zhu, W., deVries, J.E., Tamor, M.A. and Ng, K.Y. Simon, Surf. & Coat. Technol., 71 (1995) 37.Google Scholar
(22) Huong, P.V., Marcus, B., Mermoux, M., Veirs, D.K. and Rosenblatt, G.M., Diam. & Rel. Mater., 1 (1992) 869.Google Scholar
(23) Richter, F., Bewilogua, K., Kupfer, H., Mhling, I., Rau, B., Rother, B. and Schumacher, D., Thin Solid Films, 212 (1992) 245.Google Scholar
(24) Williams, B.E. and Glass, J.T., J. Mater. Res., 4(2) (1989) 373.Google Scholar
(25) Hu, H.S., Joshi, A. and Nimmagadda, R., Mater. Res. Soc. Ext. Abstract, EA–19 (1989) 103.Google Scholar
(26) Moravec, T.J. and Orent, T.W., J. Vac. Sci. Technol., 18 (1981) 226.Google Scholar