Peeling delamination and image-layer fracture of a multilayer imaging film is analyzed by a simple beam approximation. Criteria for propagation of the delamination cracks and tensile failure of the imaging layer are established. The critical role of substrate strain in controlling tensile strain in the imaging layer is explored. For the case of a thin imaging layer with a fracture strain below a critical level, image layer fracture occurs while the leading-edge delaminations length is comparable to the layer thickness. Experimental Helios film image quality is optimized at a small level of substrate tensile strain where delamination length at leading and trailing edges of small holes is balanced and small and where hole size is minimized.