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Fracture of Metal-Polymer Interfaces with Fine-Line Geometries

Published online by Cambridge University Press:  21 February 2011

Shih-Liang Chiu
Affiliation:
IBM Corp., Thomas J. Watson Research Center, Yorktown Heights, NY 10598
Y. H. Jeng
Affiliation:
IBM Corp., Thomas J. Watson Research Center, Yorktown Heights, NY 10598
Raul E. Acosta
Affiliation:
IBM Corp., Thomas J. Watson Research Center, Yorktown Heights, NY 10598
Paul Ho
Affiliation:
IBM Corp., Thomas J. Watson Research Center, Yorktown Heights, NY 10598
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Abstract

The fracture behavior of metal-polymer line structures as a function of dimensions was investigated using a stretch-deformation technique. The effects of line orientation, line width and film thickness are reported in this paper. When the line orientation is parallel to the stretching direction, only formation of cracks normal to the lines is observed. However, when the line is perpendicular to the stretching direction, delamination becomes the dominant mode of fracture. Wide lines (16μm) exhibit larger shear stress at the edge of the metal-polymer interface, thus delaminate earlier than narrow lines (4μm). By decreasing the metal film thickness, the depth of stress penetration at the interface decreases, making the propagation of cracks more difficult in thin films than in thick films.

Finite element analysis was carried out to account for the experimental observations and good agreement was obtained. In the analysis, the plastic deformation characteristics of the metal and the polymer have been specifically taken into account. In comparison with a linear elastic analysis, the linear model predicts significantly higher stress levels and local concentrations than the nonlinear model.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

1. Seraphim, D.P., Lasky, R. and Li, C.Y., Principles of Electronic Packaging, (McGraw Hill Inc., NY, 1989).Google Scholar
2. Tummala, R. R and Rymaszewski, E.J., Microelectronics Packaging Handbook, (Van Nostrand Reinhold, New York, 1989).Google Scholar
3. Kim, K.S. and Kim, J., Trans. ASME, 110, 266 (1988).Google Scholar
4. Ho, P.S. and Faupel, F., Appl. Phys. Lett., 53, 1602 (1988).Google Scholar
5. Faupel, F., Yang, C.H., Chen, S.T. and Ho, P.S., J. Appl. Phys., 65, 1911 (1989).Google Scholar
6.. Chow, T.S., Adhesion Science and Technology Vol.9B, (Plenum Press, New York, 1975), p. 687.Google Scholar
7. Chow, T.S., J. Appl. Phys., 46, 219 (1975).Google Scholar