Hostname: page-component-78c5997874-xbtfd Total loading time: 0 Render date: 2024-11-04T21:58:57.949Z Has data issue: false hasContentIssue false

Formation of Sub-100 NM GE Wires on Si by E-Beam Evaporation/Lithography

Published online by Cambridge University Press:  15 February 2011

C. Deng
Affiliation:
Department of Electrical Engineering and Applied Physics, Oregon Graduate Institute, P. O. Box 91000, Portland, OR 97291-1000
J. C. Wu
Affiliation:
Department of Physics, University of Oregon, Eugene, OR 97403, USA
C. J. Barbero
Affiliation:
Department of Electrical Engineering and Applied Physics, Oregon Graduate Institute, P. O. Box 91000, Portland, OR 97291-1000
T. W. Sigmon
Affiliation:
Department of Electrical Engineering, Arizona State University, Tempe, AZ 85287-5706
M. N. Wybourne
Affiliation:
Department of Physics, University of Oregon, Eugene, OR 97403, USA
Get access

Abstract

A fabrication process for sub-100 nm Ge wires on Si substrates is reported for the first time. Wires with a cross section of 6 × 57 nm2 are demonstrated. The wire structures are analyzed by atomic force (AFM), scanning electron (SEM), and transmission electron microscopy (TEM). Sample preparation for TEM is performed using a novel technique using both pre and in situ deposition of multiple protection layers using a Focused Ion Beam (FIB) micromachining system.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tang, Y.S., Wilkinson, C.D.W., Tores, C.M. Sotomayor, Smith, D.W., Whall, T.E. and Parker, E.H.C., Solid State Commun. 85(3), 199(1993).Google Scholar
2. Usami, N., Mine, T., Fukatsu, S. and Shiraki, Y., Solid-State Electron. 37(3–4), 539(1994).Google Scholar
3. Chang, Y., Chou, S.Y., Kramer, J., Sigmon, T.W., Marshall, A.F. and Weiner, K.H., Appl. Phys. Lett. 58(19), 2150(1991).Google Scholar
4. Nabity, J.C. and Wybourne, M.N., Rev. Sci. Instrum. 60(1), 27(1989).Google Scholar
5. Basile, D.P., Boylan, R., Baker, B., Hayes, K. and Soza, D., in Specimen Preparation for Transmission Electron Microscopy of Materials - III Symposium. ed. Anderson, R., Tracy, B., Bravman, J., (Mater. Res. Soc, 1992.) p. 23–41.Google Scholar
6. Gignac, L.M. and Edel, A.L., presented at 17th Intern. Sym. for Testing & Failure Analysis, Los Angles, California, USA, Nov., 1991.Google Scholar
7. Abelson, J. R., Sigmon, T.W., Kim, Ki Bum and Weiner, K.H., Appl. Phys. Lett. 52(3), 230(1988).Google Scholar