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Published online by Cambridge University Press: 25 February 2011
Diffusion studies of mono and bilaycrs of transition-metal films on silicon showed that the formation of η′ —Cu3Si lowers the formation temperature of subsequently forming ReSi2 by 400°C. This is due to the creation of a large amount of silicon self-interstitials accompanying the formation of the copper suicide, which lowers the activation energy for silicon diffusion. The generalization of this result - stating that the formation of all suicides, in which the volume density of silicon is much larger than in elementary silicon injects silicon self-intcrstitials into the silicon lattice - gives new insight into suicide formation, silicide-cnhanccd dopant diffusion and the self-diffusion of silicon itself6.