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Formation of Intermetallics and Grain Boundary Diffusion in Cu-Al and Au-Al Thin Film Couples*

Published online by Cambridge University Press:  15 February 2011

J. M. Vandenberg ,
F. J. A. Den Broeder  and
R. A. Hamm
J. M. Vandenberg
Affiliation:
Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974(U.S.A.)
F. J. A. Den Broeder
Affiliation:
Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974(U.S.A.)
R. A. Hamm
Affiliation:
Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974(U.S.A.)
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Extract

An in situ annealing X-ray study was applied to Cu-Al thin film couples over a wide range of copper-to-aluminum film ratios. This new technique, which has been previously described for a study on the Au-Al thin film system, enables us to make a temperature-dependent photographic X-ray analysis. The present study indicated that only a limited number of the wide variety of bulk phases form in the Cu-Al thin film interface, while some of these phases in the interface are transient. In the transient stages of the interface reaction, the f.c.c.-ordered phase β-Cu3A1 grows over the entire range of copper-to-aluminum film ratios after the first nucleation of CuA12, indicating a two-step nucleation reaction. On the aluminum-rich side, this phase transforms to a new ordered hexagonal phase β′. It could be interpreted as a superlattice of the metastable hexagonal ω phase occurring in zirconium-based alloys. The end phases are CuA1 and CuAl2.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 10: Symposium C – Thin Films and Interfaces I , 1981 , 285
Copyright
Copyright © Materials Research Society 1982

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Footnotes

†

Permanent address: Philips Research Laboratories, Eindhoven, The Netherlands.

*

Extended abstract of a paper presented at the Symposium on Thin Films and Interfaces, Boston, MA, U.S.A., November 16–19, 1981.

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