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Film Thickness Effects on Interfacial Fracture of Epoxy Bonds

Published online by Cambridge University Press:  17 March 2011

N. R. Moody ,
D. F. Bahr ,
M. S. Kent ,
J. A. Emerson  and
E. D. Reedy Jr
N. R. Moody
Affiliation:
Sandia National Laboratories, Livermore CA 94550
D. F. Bahr
Affiliation:
Washington State University, Pullman, WA 99164
M. S. Kent
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
J. A. Emerson
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
E. D. Reedy Jr
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
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Abstract

Nanoindentation test techniques were combined with deposition of highly stressed overlayers to study the interfacial fracture susceptibility of spin coated Epon 828/T403 on aluminized glass substrates as a function of film thickness. The test techniques required to induce fracture differed between samples. Nevertheless, the resulting interfacial fracture energies decreased monotonically with film thickness to a value near 0.5 J/m2. This value is higher than the ‘true work of adhesion' for uncured epoxy oliogomers on a methyl-terminated aluminum surface. However, it may indicate that we have irreversible specific interactions such as hydrogen bonding. Then 0.5 J/m2 may be near the fundamental value for such an interaction, or the ‘practical work of adhesion’.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 710: Symposia DD – Polymer Interfaces and Thin Films , 2001 , DD10.6.1
Copyright
Copyright © Materials Research Society 2002

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References

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