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Fiber-optics Low-coherence Integrated Metrology for In-Situ Non-contact Characterization of Wafer Curvature for Wafers Having Non-uniform Substrate and Thin Film Thickness

Published online by Cambridge University Press:  01 February 2011

Wojciech J. Walecki ,
Alexander Pravdivtsev ,
Kevin Lai ,
Manuel Santos II ,
Georgy Mikhaylov ,
Mihail Mihaylov  and
Ann Koo
Wojciech J. Walecki
Affiliation:
Frontier Semiconductor, 1631 North 1st Street, San Jose CA 95112
Alexander Pravdivtsev
Affiliation:
Frontier Semiconductor, 1631 North 1st Street, San Jose CA 95112
Kevin Lai
Affiliation:
Frontier Semiconductor, 1631 North 1st Street, San Jose CA 95112
Manuel Santos II
Affiliation:
Frontier Semiconductor, 1631 North 1st Street, San Jose CA 95112
Georgy Mikhaylov
Affiliation:
Frontier Semiconductor, 1631 North 1st Street, San Jose CA 95112
Mihail Mihaylov
Affiliation:
Frontier Semiconductor, 1631 North 1st Street, San Jose CA 95112
Ann Koo
Affiliation:
Frontier Semiconductor, 1631 North 1st Street, San Jose CA 95112
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Abstract

Abstract. We propose novel stress metrology technique for measurement of local values stress tensor components in the coated wafers. New metrology is based on fiber-optic low coherence interferometry and can be applied to study stress not only in semicondiuctor wafers but in wide variety applications spanning from semiconductor to construction industry where measurements of plates covered by thin film encountered in flat panel displayes, solar cells, modern windows.

Keywords

Thin-Film MetrologyDiagnosticsIn-SituReal-Time Control and MonitoringThin Film Stress MetrologyInterferometryPACS: 68.60.-p68.90.+g83.85.St95.75.Kk
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 875: Symposium O – Thin Films - Stresses and Mechanical Properties XI , 2005 , O9.4
Copyright
Copyright © Materials Research Society 2005

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References

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