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Faster Quenching by Silicon Pulsed Laser Annealing Under Water

Published online by Cambridge University Press:  28 February 2011

A. Polman
Affiliation:
FOM-Institute for Atomic and Molecular Physics Kruislaan 407, 1098 SJ Amsterdam, The Netherlands
S. Roorda
Affiliation:
FOM-Institute for Atomic and Molecular Physics Kruislaan 407, 1098 SJ Amsterdam, The Netherlands
S. B. Ogale
Affiliation:
FOM-Institute for Atomic and Molecular Physics Kruislaan 407, 1098 SJ Amsterdam, The Netherlands
F. W. Saris
Affiliation:
FOM-Institute for Atomic and Molecular Physics Kruislaan 407, 1098 SJ Amsterdam, The Netherlands
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Abstract

A novel method of pulsed laser processing of ion-implanted silicon is presented, in which samples are irradiated in water ambient. The water layer in contact with the silicon during irradiationh as a considerable influence on melting and solidificationd ynamics. Still, perfect epitaxy of a thin amorphous layer can be obtained using this method.

For epitaxy to occur on a sample irradiated under water, 40 % more absorbed energy is necessary than for a sample irradiated in air. This indicates the occurrence of a considerable heat-flow from the silicon into the water layer during the laser pulse. From impurity redistribution after irradiation it is found that by processing a sample under water liquid-phase diffusion is reduced. Diffusion theory arguments indicate that this can be due to a reduction in total melt duration by about afactor 2–3. This can be due to faster cooling of the liquid silicon layer after the laser pulse whereas the melt-in time might be influenced as well. As a consequence, shallower impurity profiles can be obtained in crystalline silicon. No oxygen incorporation is detected and the surface morphology is not disturbed using this new process.

Type
Articles
Copyright
Copyright © Materials Research Society 1987

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References

1) Laser Annealing of Semiconductors, edited by Poate, J.M. and Mayer, J.W. (Academic Press, New York, 1982).Google Scholar
2) For a review of the current literature, see other volumes in this series, Mat. Res. Soc. Symp. Proc. 1, 4, 13, 23, 35, 51 (1981–1986)Google Scholar
3) Bruines, J.J.P., van Hal, R.P.M. and Boots, H.M.J., Polman, A. and Saris, F.W., Appl. Phys. Lett. 49, 1161 (1986)Google Scholar
4) White, C.W., Pronko, P.P., Wilson, S.R., Appleton, B.R., Narayan, J. and Young, R.T., J. Appl. Phys. 50, 3261 (1979)Google Scholar
5) Narayan, J., White, C.W., Holland, O.W. and Aziz, M.J., J. Appl. Phys. 56, 1821 (1984)Google Scholar
6) Kodera, S.H., Jap. J. Appl. Phys. 2, 212 (1965)Google Scholar
7) Cullis, A.G., Webber, H.C. and Bailey, P., J.Phys.E: Sci. Instrum. 12 (1979) 688 CrossRefGoogle Scholar
8) Backscattering Spectrometry, Chu, W.-K., Mayer, J.W. and Nicolet, M.-A. (Academic Press, New York, 1978)CrossRefGoogle Scholar
9) Semiconductors and Semimetals, Vol.23, Pulsed laser Processing of Semiconductors, edited by Wood, R.F., White, C. and Young, R.T. (Mc Graw Hill, New York, 1984)Google Scholar
10) Ogale, S.B., Polman, A., Quentin, F.O.P, Roorda, S. and Saris, F.W., accepted for publication in Appl. Phys. Lett.Google Scholar
11) Wang, Z.L., Westendorp, J.F.M. and Saris, F.W., Nucl. Instr. Meth. 211 (1983) 193 CrossRefGoogle Scholar