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Failure Analysis of Thermally Shocked NiCr Films on Mn-Ni-Co Spinel Oxide Substrates

Published online by Cambridge University Press:  01 February 2011

Min-Seok Jeon ,
Jun-Kwang Song ,
Eui-Jong Lee ,
Yong-Nam Kim ,
Hyun-Gyu Shin  and
Hee-Soo Lee
Min-Seok Jeon
Affiliation:
Material Testing Team, Korea Testing Laboratory, 222-13 Guro-dong, Guro-gu, Seoul 152-848, KOREA
Jun-Kwang Song
Affiliation:
Material Testing Team, Korea Testing Laboratory, 222-13 Guro-dong, Guro-gu, Seoul 152-848, KOREA
Eui-Jong Lee
Affiliation:
Material Testing Team, Korea Testing Laboratory, 222-13 Guro-dong, Guro-gu, Seoul 152-848, KOREA
Yong-Nam Kim
Affiliation:
Material Testing Team, Korea Testing Laboratory, 222-13 Guro-dong, Guro-gu, Seoul 152-848, KOREA
Hyun-Gyu Shin
Affiliation:
Material Testing Team, Korea Testing Laboratory, 222-13 Guro-dong, Guro-gu, Seoul 152-848, KOREA
Hee-Soo Lee
Affiliation:
Material Testing Team, Korea Testing Laboratory, 222-13 Guro-dong, Guro-gu, Seoul 152-848, KOREA
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Abstract

NiCr films were thermally evaporated on the Mn-Ni-Co-O thick-film substrates. The NiCr/Mn-Ni-Co-O bi-layer systems were tested in a thermal shock chamber with three temperature differences of 150, 175 and 200°C. The systems were considered to have failed when the sheet resistance of NiCr films changed by 30% relative to an initial value. As the cyclic repetition of thermal shock increased, the sheet resistance of NiCr coatings increased. The Coffin-Manson equation was applied to the failure mechanism of cracking of NiCr coatings and the SEM observation of cracks and delamination in NiCr coatings due to thermal cycling agreed well with the failure mechanism.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 875: Symposium O – Thin Films - Stresses and Mechanical Properties XI , 2005 , O12.21
Copyright
Copyright © Materials Research Society 2005

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References

1. Belic, L.I., Pozun, K., and Remskar, M., Thin Solid Films, 317, 173 (1998).Google Scholar
2. Takeda, S., Vacuum, 41, 1769 (1990).Google Scholar
3. Peled, A., Farhadyan, J., Zloof, Y., and Baranauskas, V., Vacuum, 45, 5 (1994).Google Scholar
4. Nelson, W., Accelerated Testing, (John Wiley & Sons, New York, 1990).Google Scholar
5. EIA/JEP122B, “Failure mechanisms and models for semiconductor devices”, EIA/JEDEC Pub. Aug. 2003.Google Scholar
6. Fagan, J.G., American Ceramic Society Bulletin, 72, 70 (1993).Google Scholar
7. Lesage, J., Staia, M.H., Chicot, D., Godoy, C., and Mirande, P.E.V. De, Thin Solid Films, 377, 681 (2000).Google Scholar
8. Coffin, L.F. Jr, ASME Transactions, 76, 931 (1954).Google Scholar
9. Manson, S.S., Experimental Mechanics, 5, 193 (1965).Google Scholar