Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-29T07:24:59.863Z Has data issue: false hasContentIssue false
  • English
  • Français

Facet-Facet Barrier on Surfaces: Proposal and Experimental Validation

Published online by Cambridge University Press:  11 February 2011

Hanchen Huang ,
C. H. Woo ,
H. L. Wei ,
S. J. Liu ,
X. X. Zhang ,
M. Altman  and
E. G. Wang
Hanchen Huang*
Affiliation:
Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180
C. H. Woo
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
H. L. Wei
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
S. J. Liu
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
X. X. Zhang
Affiliation:
Department of Physics, Hong Kong University of Science and Technology, Hong Kong
M. Altman
Affiliation:
Department of Physics, Hong Kong University of Science and Technology, Hong Kong
E. G. Wang
Affiliation:
Institute of Physics, Chinese Academy of Science, Beijing.
*
* (E-mail: [email protected])
Get access

Abstract

Surface processing is generally kinetics limited. Migration barriers, both on flat surfaces and near steps, therefore are of crucial importance. In this paper, we describe a kinetic barrier that separates two neighboring facets on surfaces. The contrast of this concept relative to the conventional Ehrlich-Schwoebel barrier is shown through molecular dynamics/statics calculations on copper and aluminum. The effects of this new kinetic barrier are demonstrated through lattice Monte Carlo simulations. The predicted effects are in direct correspondence with validation experiments on copper and silver thin films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 749: Symposium W – Morphological and Compositional Evolution of Thin Films , 2002 , W18.7
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Vaidya, S. and Sinha, A. K., Thin Solid Films 75, 523 (1981).Google Scholar
2. Greene, J., Sundgren, J., Hultman, L., Petrov, I., and Bergstrom, D., Appl. Phys. Lett. 67, 2928 (1995).Google Scholar
3. Huang, H., Gilmer, G. H. and Diaz de la Rubia, T., J. Appl. Phys. 84, 3636 (1998).Google Scholar
4. Gilmer, G. H., Huang, H., Diaz de la Rubia, T., Torre, J. D. and Barumann, F., Thin Solid Films 365, 189 (1999).Google Scholar
5. Huang, H. and Gilmer, G. H., J. Computer-Aided Mater. Design 7, 203 (2001).Google Scholar
6. Schwoebel, R. L. and Shipsey, E. J., J. Appl. Phys. 37, 3682 (1966).Google Scholar
7. Ehrlich, G. and Hudda, F. G., J. Chem. Phys. 44, 1039 (1966).Google Scholar
8. Hsiung, L., private communication.Google Scholar
9. Liu, S. J., Huang, H., and Woo, C. H., Appl. Phys. Lett. 80, 3295 (2002);Google Scholar
Liu, S. J., Wang, E. G., Woo, C. H., and Huang, H., J. Computer-Aided Mater. Design 7, 195 (2001);Google Scholar
Lagally, M. G. and Zhang, Z. Y., Nature 417, 907 (2002).Google Scholar
10. Huang, H., Wei, H. L., Woo, C. H., and Zhang, X. X., Appl. Phys. Lett. 82, 1272 (2003).Google Scholar
11. Huang, H., Wei, H. L., Woo, C. H., and Zhang, X. X., Appl. Phys. Lett. 81, 4359 (2002).Google Scholar
12. Tang, W.X., Man, K.L., Huang, H., Woo, C.H., and Altman, M.S., J. Vac. Sci. Tech. B 20, 2492 (2002).Google Scholar