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Fabrication of Hollow High Aspect Ratio Metal Microstructure Arrays

Published online by Cambridge University Press:  25 February 2011

J. M. Calvert
Affiliation:
Center for Bio/Molecular Science and Engineering, Code 6090, Naval Research Laboratory, Washington, DC 20375–5000
J. H. Georger JR
Affiliation:
Geo-Centers, Inc., Ft. Washington, MD 20744
M. L Rebbert
Affiliation:
Nanoelectronics Process Facility, Code 6804, NRL
M. A. Anderson
Affiliation:
Geo-Centers, Inc., Ft. Washington, MD 20744
D. Park
Affiliation:
Nanoelectronics Process Facility, Code 6804, NRL
J. J. Hickman
Affiliation:
Science Applications International Co., McLean, VA 22102
C. S. Dulcey
Affiliation:
Center for Bio/Molecular Science and Engineering, Code 6090, Naval Research Laboratory, Washington, DC 20375–5000
M. C. Peckerar
Affiliation:
Nanoelectronics Process Facility, Code 6804, NRL
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Abstract

A process has been developed to produce regular arrays of hollow metal microstructures on substrates of choice. Optical lithography was used to define high aspect ratio structures in photoresist. The resist structures were selectively metallized by electroless (EL) deposition such that metal was deposited only on the sidewalls of the resist and on the surface of the substrate. Dissolution of the polymeric photoresist resulted in regular arrays of hollow metal cylinders and cones with geometries and structure spacings determined by the original resist structures. Characterization of metallized microstructures using surface analytical techniques and SEM is presented. Arrays of microstructures with 500–1000 Å thick EL Ni walls and aspect ratios (height/tip diameter) of 8:1 are shown.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

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