Hostname: page-component-78c5997874-v9fdk Total loading time: 0 Render date: 2024-11-05T13:29:02.627Z Has data issue: false hasContentIssue false
  • English
  • Français

Fabrication of C54-TiSi2 Thin Films Using Cathodic Arc Deposition and Rapid Thermal Annealing

Published online by Cambridge University Press:  01 February 2011

Hui Xia ,
William R. Knudsen  and
Paul L. Bergstrom
Hui Xia
Affiliation:
[email protected], Mich Tech Univ, Mater. Sci. & Engi., 1400 Townsend Dr., Houghton, MI, 49931, United States
William R. Knudsen
Affiliation:
[email protected], Michigan Technological University, College of Engineering, Houghon, MI, 49931, United States
Paul L. Bergstrom
Affiliation:
[email protected], Michigan Technological University, Department of Electrical and Computer Engineering, Houghton, MI, 49931, United States
Get access

Abstract

Due to its low electrical resistivity and high thermal stability, C54-TiSi2 thin films can be used in some MEMS application, such as RF MEMS, to reduce RC delay and improve dynamic performance. In this paper, TiSi2 thin films have been prepared for the first time by using cathodic arc deposition to study the impact of energetic ion bombardment on the film microstructure and subsequent C49-C54 phase transformation during annealing. TiSi2 compound was used as the cathode and a substrate bias was varied to control kinetic energy of the ions during the film growth. Rutherford backscattering spectrometry and transmission electron microscopy were utilized to characterize the film composition and microstructure. The composition of the resultant TiSix thin films varies from x=2.4 to x=1.4 when the substrate bias was varied from floating to –200V. The as-deposited TiSix films are amorphous under no substrate heating and a phase separation at nano scale with inhomogeneous distribution of Ti and Si atoms was observed within the amorphous phase. Si atoms are seen to segregate on the boundary of Ti-rich domains and the domain size increased with the substrate bias. For a 90nm-thick TiSi2 film deposited on a SiO2/Si substrate, kinetics of the C49-C54 phase transformation was studied by measuring the change of film resistivity upon rapid thermal annealing. It was found that the C49-C54 phase transition temperature is higher (>900°C) for the arc-deposited TiSi2 thin films compared to evaporated and sputtered films and the activation energy for the transformation was calculated to be 6.1±0.2eV.

Keywords

thin filmannealingion-beam assisted deposition
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD06-29
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Gambino, J. P., Colgan, E. G., Mater. Chem. and Phys., 52, 99 (99).Google Scholar
2 Ma, Z. and Allen, L. H., Physical Review B 49(19), 13501 (1994).Google Scholar
3 Thompson, R. D., Takai, H., Psaras, P. A., and Tu, K. N., J. Appl. Phys. 61(2), 540 (1986).Google Scholar
4 Houtum, H. J. W. V., Raaijmakers, I. J. M. M., and Menting, T. J. M., J. Appl. Phys. 61(8), 3116 (1987).Google Scholar
5 Chang, J., Kim, G. B., Yoon, D. S., Baik, H. K., Yoo, D. J. and Lee, S. M., Applied Physics Letters. 75, 2900 (2900).Google Scholar
6 Brown, I. G., Annu. Rev. Mater. Sci. 28, 243 (243).Google Scholar
7 Xia, H., Yang, Y., and Bergstrom, P. L. in Low-Temperature Silicon Films Deposition by Pulsed Cathodic Arc Process for Microsystems Technologies, edited by Ganguly, G., Kondo, M., Schiff, E. A., Carius, R., Biswas, R., (Mater. Res. Soc. Symp. Proc. 808, Pittsburgh, PA, 2004) pp. A9.38.1.Google Scholar
8 Christian, J. W., The Theory of Transformation in Metals and Alloys, Part I, Pergamon, Oxford. (1975).Google Scholar