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Experimental Stress Analysis Methods and Some Thin Film Applications

Published online by Cambridge University Press:  22 February 2011

Joan K. Vrtis  and
Richard J. Farris
Joan K. Vrtis
Affiliation:
University of Massachusetts, Department of Polymer Science and Engineering, Amherst, MA 01003
Richard J. Farris
Affiliation:
University of Massachusetts, Department of Polymer Science and Engineering, Amherst, MA 01003
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Abstract

Interference holographic methods are applied to thin film structures to determine their state of stress and their thermal and mass diffusion coefficients. Special sample preparation techniques are used to produce tensioned membrane samples that preserve the state of stress in coated parts. Then utilizing real time vibrational holographic interferometry methods, the total state of stress can be determined, two normal stresses and a shearstress. Similar samples exposed to moisture have their stress state altered by swelling and this can be monitored on a real-time basis and the influence on stress state and thethrough-the-thickness moisture diffusion coefficient can be determined. In related experiments using similar methods, the through-the-thickness thermal diffusion coefficient can be determined using pulse heating methods. These methods coupled with routine test methods enables one to fully characterize all of the orthotropic elasticity coefficients and transport characteristics needed for numerial analyses of thin film structures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 527
Copyright
Copyright © Materials Research Society 1994

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References

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