Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-29T07:52:41.533Z Has data issue: false hasContentIssue false

Ex Situ and In Situ Methods for Complete Oxygen and Non-Carbidic Carbon Removal from (0001)SI 6H-SiC Surfaces

Published online by Cambridge University Press:  15 February 2011

Sean W. King
Affiliation:
Department of Materials Science and Engineering, and Department of Physics North Carolina State University, Raleigh, NC 27695.
Mark C. Benjamin
Affiliation:
Department of Materials Science and Engineering, and Department of Physics North Carolina State University, Raleigh, NC 27695.
Richard S. Kern
Affiliation:
Department of Materials Science and Engineering, and Department of Physics North Carolina State University, Raleigh, NC 27695.
Robert J. Nemanich
Affiliation:
Department of Materials Science and Engineering, and Department of Physics North Carolina State University, Raleigh, NC 27695.
Robert F. Davis
Affiliation:
Department of Materials Science and Engineering, and Department of Physics North Carolina State University, Raleigh, NC 27695.
Get access

Abstract

Comparisons between the wetting characteristics of (0001)si 6H-SiC and (111) Si surfaces in various acids and bases were made. It was found that 10:1 HF dipped Si (111) surfaces were hydrophobic where as the (0001)si 6H-SiC surfaces were hydrophilic. (0001)si 6H-SiC surfaces capped with a 20Å Si layer, however, were hydrophobic after HF dipping and exhibited outgassing levels on annealing which were several orders of magnitude lower than SiC wafers dipped in HF without the capping layer. Annealing the Si capped (0001)si 6H-SiC surfaces in UHV at 1100°C for 5 min. was found to be sufficient to thermally desorb the Si capping layer and produce a (3×3) Si rich, oxygen free (0001)si 6H-SiC surface.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kern, W., J. Electrochem. Soc., 137 (6) 1887 (1990).Google Scholar
2. Williams, R., Modem GaAs Processing Methods, 2nd ed. (Artech House, Inc., New York, 1990), pp. 81114.Google Scholar
3. Srinivasan, G.R. and Meyerson, B.S., J. Electrochem. Soc., 134 (6) 1518 (1987).Google Scholar
4. Meyerson, B.S., Ganin, E., Smith, D.A., and Nguyen, T.N., J. Electrochem. Soc., 133 (6) 1232 (1986).Google Scholar
5. Sanganeria, M.K., Ozturk, M.C., Harris, G., Violette, K.E., Ban, I., Lee, C.A., and Maher, D.M, J. Electrochem. Soc. 142 (11), 3961 (1995).Google Scholar
6. Mizokawa, Y., Nakanishi, S., Komoda, O., Miyase, S., Diang, H.S., Wang, C., Li, N., and Jiang, C., J. Appl. Phys., 67 (1) 264 (1990).Google Scholar
7. Tsuchida, H., Kamata, I., and Izumi, K., Jpn. J. Appl. Phys., 34 6003 (1995).Google Scholar
8. Porter, L.M., Davis, R.F., Bow, J.S., Kim, M.J., Carpenter, R.W., Glass, R.C., J. Mater. Res. 10 (3) 668 (1995).Google Scholar
9. Meyerson, B.S., Himpsel, F.J., and Uram, K.J., Appl. Phys. Lett. 57, 1034 (1990).Google Scholar
10. Grundner, M. and Jacob, H., Appl. Phys. A 39, 73 (1986).Google Scholar
11. Chabal, Y.J., Higashi, G.S., Raghavachari, K., and Burrows, V.A., J. Vac. Sci. Technol. A, 7 (3), 2104 (1989).Google Scholar
12. Kern, R.S., King, S.W., and Davis, R.F, to be published.Google Scholar
13. Kaplan, R., Surf. Sci. 215, 111 (1989).Google Scholar
14. Fissel, A., Schroter, B., Ducke, E., Schroter, B., and Richter, W., J. Cryst. Growth 154, 72 (1995).Google Scholar
15. McClintock, J.A., Wilson, R.A., and Byer, N.E., J. Vac. Sci. Technol. 20, 241 (1982.)Google Scholar
16. van der Weide, J. and Nemanich, R.J., Appl. Phys. Lett. 62 1878 (1985).Google Scholar
17. Higashi, G.S., Becker, R.S., Chabal, Y.J., Becker, A.J., Appl. Phys. Lett. 58, 1656 (1991).Google Scholar
18. Higashi, G.S., Chabal, Y.J., Trucks, G.W., and Raghavachari, K., Appl. Phys. Lett. 56, 656 (1990).Google Scholar
19. Rowland, L., Northrop-Grumman. Private communication.Google Scholar