Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-25T15:24:56.782Z Has data issue: false hasContentIssue false
  • English
  • Français

Evolving Surface Cusps During Strained Layer Epitaxy

Published online by Cambridge University Press:  15 February 2011

D. E. Jesson ,
S. J. Pennycook ,
J.-M. Baribeau  and
D. C. Houghton
D. E. Jesson
Affiliation:
Solid State Division, Oak Ridge National Laboratory, P.O. Box 2008, Oak Ridge, TN 37831-6030
S. J. Pennycook
Affiliation:
Solid State Division, Oak Ridge National Laboratory, P.O. Box 2008, Oak Ridge, TN 37831-6030
J.-M. Baribeau
Affiliation:
Institute for Microstructural Sciences, National Research Council of Canada, Ottawa K1A OR6, Canada
D. C. Houghton
Affiliation:
Institute for Microstructural Sciences, National Research Council of Canada, Ottawa K1A OR6, Canada
Get access

Abstract

We have combined Z-contrast imaging and Ge marker layer experiments to study the evolving surface morphology of SixGel-x alloys grown by molecular beam epitaxy (MBE). Surface cusps are seen to arise as the intersection lines between coherent islands. The potential implications of stress concentrations associated with cusps are considered with a view to strain relaxation in the film via dislocation nucleation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 312: Symposium P – Common Themes and Mechanisms of Epitaxial Growth , 1993 , 47
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Srolovitz, D. J., Acta Metall. 37, 621 (1989).CrossRefGoogle Scholar
[2] Eaglesham, D. J. and Cerullo, M., Phys. Rev. Lett. 64, 1943 (1990).CrossRefGoogle Scholar
[3] Pennycook, S. J. and Jesson, D. E., Phys. Rev. Lett. 64, 938 (1990).CrossRefGoogle Scholar
[4] Pennycook, S. J. and Jesson, D. E., ”High-Resolution Imaging in the Scanning Transmission Electron Microscope,” Proc. Intl School on Electron Microscopy in Materials Science, Brindisi, Italy, World Scientific Publishing Co., Singapore, New Jersey, London, Hong Kong (1992) p. 333–362.Google Scholar
[5] See, for example, Knott, J. F., Fundamentals of Fracture Mechanics, John Wiley and Sons, Inc., New York, Toronto, 1973.Google Scholar
[6] Mullins, W. W., J. Appl. Phys. 28, 333 (1957).CrossRefGoogle Scholar
[7] Jesson, D. E., Pennycook, S. J., Baribeau, J.–M., and Houghton, D. C. (submitted to Physical Review Letters).Google Scholar
[8] Matthews, J. W., J. Vac. Sci. Techn. 12, 126 (1975).CrossRefGoogle Scholar
[9] See, for example, Tetelman, A. S. and McEvily, A. J., Fracture of Structural Materials, John Wiley and Sons, Inc., New York, London, Sydney, 1967, p. 49.Google Scholar
[10] LeGoues, F. K., Meyerson, B. S., and Morar, J. F., Phys. Rev. Lett. 66, 2903 (1991).CrossRefGoogle Scholar
[11] Pidduck, A. J. et al., Thin Solid Films 222, 78 (1992).CrossRefGoogle Scholar
[12] We would like to thank Carney, S. L., Estes, T. C., and J. T. Luck for technical assistance. This research was sponsored by the Division of Materials Sciences, U.S. Department of Energy, under contract DE-AC05-84OR21400 with Martin Marietta Energy Systems, Inc.Google Scholar